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Study on the uniformity of microgrooves in through-mask electrochemical micromachining with moving cathode

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Abstract

Through-mask electrochemical micromachining (TMEMM) has been widely used in the machining of micro-structures because of its high processing efficiency, no electrode loss, and no residual stress. In order to solve the problem of poor structure uniformity in the process of TMEMM, this paper proposed a moving cathode TMEMM technology on the basis of conventional TMEMM and made a microgroove array based on the moving cathode TMEMM technology. Firstly, the numerical analysis of moving cathode TMEMM was carried out by COMSOL finite element analysis software. The influence of different machining parameters on the anodic micro-groove etching profile was studied and the nonuniformity of the etching depth was calculated. The simulation results show that moving cathode TMEMM can improve the etching depth uniformity of microgroove array structure. Secondly, on the basis of numerical simulation, TMEMM experiments were carried out. The experimental results indicate that the moving cathode TMEMM method can effectively improve the size uniformity of microgroove array. It can be observed by microscope that the microgroove array obtained by TMEMM with a moving cathode has good structural morphology and higher uniformity. Compared with conventional TMEMM, the uniformity of TMEMM with moving cathode improved by 68.3% and the simulation results are basically consistent with the experimental results. The moving cathode TMEMM method can greatly improve the uniformity of microgroove array.

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Funding

This work was supported by the National Key Research and Development Program of China (No. 2022YFB4600102), the Natural Science Foundation of Hebei Province of China (No. E2022201028), and National Natural Science Foundation of China (No. 51975103).

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Authors and Affiliations

  1. National & Local Joint Engineering Research Center of Metrology Instrument and System, College of Quality and Technical Supervision, Hebei University, Baoding, 071002, China

    Ke Zhai, Feng Zhou & Wenya Xu

  2. System Engineering Institute of Sichuan Aerospace, Chengdu, 610100, China

    Yikui Wen

  3. Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian, 116024, China

    Liqun Du

Authors
  1. Ke Zhai
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  2. Feng Zhou
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  3. Yikui Wen
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  4. Wenya Xu
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  5. Liqun Du
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Contributions

Ke Zhai: all experiments, design of device, and writing; Feng Zhou: material preparation and writing; Yikui Wen: part of the electrochemical experiments and characterization; Wenya Xu: data collection and analysis. Liqun Du: conceptualization, methodology, writing, and supervision of students.

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Correspondence to Liqun Du.

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Zhai, K., Zhou, F., Wen, Y. et al. Study on the uniformity of microgrooves in through-mask electrochemical micromachining with moving cathode. Int J Adv Manuf Technol 127, 2737–2744 (2023). https://doi.org/10.1007/s00170-023-11629-1

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  • DOI: https://doi.org/10.1007/s00170-023-11629-1

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