Abstract
Double-sided lapping process with fixed abrasive shows a strong capability of achieving high efficiency and high surface quality due to its controllable movement of the abrasive and determined material removal modes, and it can be as an alternative technology for fabricating ultra-precision optical components. However, the formation and evolution of the surface topography and roughness (Ra) were rarely clarified in the previous research due to the complicity of the double-sided lapping process. This paper established a new mathematical analytical model to provide a better scientific understanding of the formation and evolution of the surface topography and roughness, in which the spatial location and protrusion height of abrasive particles, each abrasive-material interaction, kinematics trajectory of abrasive particles, and force balance on the workpiece were considered. A series of lapping experiments on the Y3Al5O12 (YAG) wafer were conducted to verify the feasibility of the proposed model and analyze the influence of processing parameters on surface topography and roughness evolution. The results indicated that the proposed analytical model can be effectively used to predict surface topography and optimize the process parameters of double-sided planetary lapping for better surface roughness. The variation of processing time and rotational speed of the lapping plate (pad) possesses a significant influence on surface topography and Ra values. Better surface Ra values can be achieved by selecting the proper processing time and rotational speed of the lapping plate.
Similar content being viewed by others
Data availability
Data used to support the findings of this study are available from the corresponding author upon request.
Code availability
Not applicable
References
Lee D, Kim D, Gweon D et al (2007) A calibrated atomic force microscope using an orthogonal scanner and a calibrated laser interferometer. Appl Surf Sci 253:3945–3951. https://doi.org/10.1016/j.apsusc.2006.08.027
Postava K, Aoyama M, Mistrik J et al (2007) Optical measurements of silicon wafer temperature. Appl Surf Sci 254:416–419. https://doi.org/10.1016/j.apsusc.2007.07.086
Campbell JH, Hayden JS, Marker A (2011) High-power solid-state lasers: a laser glass perspective. Int J Appl Glass Sci 2:3–29. https://doi.org/10.1111/j.2041-1294.2011.00044.x
Xie R, Zhao S, Liao D et al (2019) Surface characteristics of polished YAG laser crystal. Cryst Res Technol 54:1800274. https://doi.org/10.1002/crat.201800274
Du D, Wu Y, Zhao Y et al (2020) Deformation and fracture behaviours of a YAG single crystal characterized using nanoindentation method. Mater Charact 164:110302. https://doi.org/10.1016/j.matchar.2020.110302
Lee T, Kim H, Lee S et al (2017) Self-dressing effect using a fixed abrasive platen for single-sided lapping of sapphire substrate. J Mech Sci Technol 31:5649–5655. https://doi.org/10.1007/s12206-017-1105-1
Gates JD (1998) Two-body and three-body abrasion: a critical discussion. Wear 214:139–146. https://doi.org/10.1016/S0043-1648(97)00188-9
Enomoto T, Satake U, Fujita T et al (2013) Spiral-structured fixed-abrasive pads for glass finishing. CIRP Ann 62:311–314. https://doi.org/10.1016/j.cirp.2013.03.011
Pan Y, Zhou P, Yan Y et al (2021) New insights into the methods for predicting ground surface roughness in the age of digitalisation. Precis Eng 67:393–418. https://doi.org/10.1016/j.precisioneng.2020.11.001
Aggarwal V, Khangura SS, Garg RK (2015) Parametric modeling and optimization for wire electrical discharge machining of Inconel 718 using response surface methodology. Int J Adv Manuf Technol 79:31–47. https://doi.org/10.1007/s00170-015-6797-8
Kwak J, Sim S, Jeong Y (2006) An analysis of grinding power and surface roughness in external cylindrical grinding of hardened SCM440 steel using the response surface method. Int J Mach Tools Manuf 46:304–312. https://doi.org/10.1016/j.ijmachtools.2005.05.019
Fredj NB, Amamou R (2006) Ground surface roughness prediction based upon experimental design and neural network models. Int J Adv Manuf Technol 31:24–36. https://doi.org/10.1007/s00170-005-0169-8
Jiang JL, Ge PQ, Bi WB et al (2013) 2D/3D ground surface topography modeling considering dressing and wear effects in grinding process. Int J Mach Tools Manuf 74:29–40. https://doi.org/10.1016/j.ijmachtools.2013.07.002
Dong Z, Cheng H (2014) Study on removal mechanism and removal characters for sic and fused silica by fixed abrasive diamond pellets. Int J Mach Tools Manuf 85:1–13. https://doi.org/10.1016/j.ijmachtools.2014.04.008
Ding W, Dai C, Yu T et al (2017) Grinding performance of textured monolayer CBN wheels: undeformed chip thickness nonuniformity modeling and ground surface topography prediction. Int J Mach Tools Manuf 122:66–80. https://doi.org/10.1016/j.ijmachtools.2017.05.006
Gong YD, Wang B, Wang WS (2002) The simulation of grinding wheels and ground surface roughness based on virtual reality technology. J Mater Process Technol 129:123–126. https://doi.org/10.1016/S0924-0136(02)00589-7
Zhou W, Tang J, Chen H et al (2018) A comprehensive investigation of plowing and grain-workpiece micro interactions on 3D ground surface topography. Int J Mech Sci 144:639–653. https://doi.org/10.1016/j.ijmecsci.2018.06.024
Lin B, Jiang X, Cao Z et al (2020) Theoretical and experimental analysis of material removal and surface generation in novel fixed abrasive lapping of optical surface. J Mater Process Technol 279:116570. https://doi.org/10.1016/j.jmatprotec.2019.116570
Li C, Wu Y, Li X et al (2020) Deformation characteristics and surface generation modelling of crack-free grinding of GGG single crystals. J Mater Process Technol 279:116577. https://doi.org/10.1016/j.jmatprotec.2019.116577
Bin L, Junpeng Z, Zhong-Chen C et al (2022) Theoretical and experimental investigation on surface generation and subsurface damage in fixed abrasive lapping of optical glass. Int J Mech Sci 215:106941. https://doi.org/10.1016/j.ijmecsci.2021.106941
Liu Y, Warkentin A, Bauer R et al (2013) Investigation of different grain shapes and dressing to predict surface roughness in grinding using kinematic simulations. Precis Eng 37:758–764. https://doi.org/10.1016/j.precisioneng.2013.02.009
Tao H, Liu Y, Zhao D et al (2022) Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process. Tribol Int 171:107547. https://doi.org/10.1016/j.triboint.2022.107547
Tao H, Liu Y, Zhao D et al (2022) The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers. Int J Mech Sci 222:107240. https://doi.org/10.1016/j.ijmecsci.2022.107240
Junpeng Z, Zhong-Chen C, Yang Z et al (2022) Investigation on surface evolution and subsurface damage in abrasive lapping of hard and brittle materials using a novel fixed lapping tool. J Manuf Process 75:729–738. https://doi.org/10.1016/j.jmapro.2022.01.038
Yang L, Guo X, Kang R et al (2022) Effect of kinematic parameters considering workpiece rotation on surface quality in YAG double-sided planetary lapping with the trajectory method. Int J Adv Manuf Technol 123:2679–2690. https://doi.org/10.1007/s00170-022-10288-y
Gu W, Yao Z, Li H (2011) Investigation of grinding modes in horizontal surface grinding of optical glass BK7. J Mater Process Technol 211:1629–1636. https://doi.org/10.1016/j.jmatprotec.2011.05.006
Li HN, Yu TB, Zhu LD et al (2017) Analytical modeling of grinding-induced subsurface damage in monocrystalline silicon. Mater Des 130:250–262. https://doi.org/10.1016/j.matdes.2017.05.068
Wang Y, Guangheng D, Zhao J et al (2019) Study on key factors influencing the surface generation in rotary ultrasonic grinding for hard and brittle materials. J Manuf Process 38:549–555. https://doi.org/10.1016/j.jmapro.2019.01.046
Wang L, Hu Z, Fang C, Yu Y, Xu X (2018) Study on the double-sided grinding of sapphire substrates with the trajectory method. Precis Eng 51:308–318. https://doi.org/10.1016/j.precisioneng.2017.09.001
Funding
National Natural Science Foundation of China (51991372)
Author information
Authors and Affiliations
Contributions
Renke Kang contributed to the conception of the study.
Yufan Jia performed the experiment.
Xianglong Zhu contributed significantly to the analysis and manuscript preparation.
Lei Yang performed the data analyses and wrote the manuscript.
Xiaoguang Guo helped perform the analysis with constructive discussions.
Corresponding author
Ethics declarations
Ethics approval
Not applicable
Consent to participate
Not applicable
Consent for publication
Not applicable
Competing interests
The authors declare no competing interests.
Additional information
Publisher's note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Yang, L., Guo, X., Kang, R. et al. Theoretical and experimental analysis of surface topography and surface roughness evolution in fixed abrasive double-sided planetary lapping of YAG wafers. Int J Adv Manuf Technol 127, 195–209 (2023). https://doi.org/10.1007/s00170-023-11417-x
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00170-023-11417-x