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Transverse heterogeneity of bonding strength in Ti/steel clad plates fabricated by hot rolling with bimetal assembling

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Abstract

In this paper, the copper-based welding wire was used to complete the double-layer billet assembling, and bimetal Ti/steel clad plates were successfully prepared by hot rolling. The transverse bonding strength distribution was studied through microstructure characterization and the finite element method (FEM). The influence factors of oxidation, temperature, and stress were discussed. The results showed that the bond strength exhibited a transverse heterogeneity, which was 294 MPa at the width center and gradually decreased to 101 MPa at the width edge. Correspondingly, the interface at the center was well bonded while it contained cracks and voids at the edge. The oxidation occurred only at the edge for cracking in the weld during rolling, which deteriorated the bonding strength. The temperature along the width direction had little effect on the bonding strength for its small drop. Compared with these, the decreased normal stress from center to edge caused by the width resistance and metal flow characteristics was the main reason for the transverse heterogeneity of bonding strength. Based on this, a transverse bonding strength prediction equation considering the distribution of stress and bonding strength was proposed, and the relative error of it was 8 ~ 15%.

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Funding

The authors would like to thank the support from the National Key Research and Development Program (2018YFA0707300), Major Program of National Natural Science Foundation of China (U22A20188).

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Yue Wu: investigation, methodology, data curation, writing original draft; Tao Wang: conceptualization, methodology; Tingting Zhang: writing—review and editing; Zhongkai Ren: microstructure analysis.

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Correspondence to Tao Wang.

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Wu, Y., Wang, T., Zhang, T. et al. Transverse heterogeneity of bonding strength in Ti/steel clad plates fabricated by hot rolling with bimetal assembling. Int J Adv Manuf Technol 126, 5033–5046 (2023). https://doi.org/10.1007/s00170-023-11369-2

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