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Heat transfer mechanisms of nano-cutting fluids: a comparative performance analysis model

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Abstract

Nano-cutting fluids technology proved its effectiveness to enhance the quality of the machining processes’ performance, especially for difficult-to-cut materials, as these materials have potential applications in different industries, including automotive, gas turbine, and aerospace. Thus, the development, understanding, and investigation of the nano-cutting-fluid mechanisms are highly essential. The main objective of this work is to study and analyze the nano-cutting fluid heat transfer mechanisms. A proposed heat transfer model has been developed in this work to provide a solid physical understanding of heat dissipation when machining with nanofluids. In addition, a comparative performance analysis between multi-walled carbon nanotubes (MWCNTs) and alumina (Al2O3) nano-cutting fluids has been presented, discussed, and validated throughout the current study. The proposed model findings offer physical explanations that justify the tool performance results presented in a previous work since MWCNTs nanofluid offered better heat transfer performance (in terms of heat convection coefficient and thermal diffusivity) compared to Al2O3 nano-cutting fluid when cutting nickel-based alloys.

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Abbreviations

Bi:

Biot number

C p :

The protective film-specific heat

d :

The separation distance between the workpiece and cutting tool surfaces

\({E}_{\mathrm{in}}\) :

Input/generated thermal energy rate

\({E}_{\mathrm{out}}\) :

Output/dissipated thermal energy rate

f c :

The cutting force

h :

The nano-cutting fluid mixture convection coefficient

K :

The resultant nanofluid thermal conductivity

m film :

The protective film mass

MQL:

Minimum quantity lubrication

MWCNTs:

Multi-walled carbon nanotubes

\({q}^{\mathrm{^{\prime}}\mathrm{^{\prime}}\mathrm{^{\prime}}}\) :

Amount of heat generation

s :

The protective film thickness

T ∞ :

The ambient temperature

T film :

The protective film temperature

T interface :

The cutting interface temperature

t o :

The undeformed chip thickness

T S1 :

The workpiece surface temperature

v :

The cutting velocity

V film :

The protective film volume

w :

The chip width

\({\Delta E}_{\mathrm{stored}}\) :

The change of thermal energy content

\({\rho }_{\mathrm{film}}\) :

The protective film density

\(\alpha\) :

The protective film thermal diffusivity

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Funding

This study was funded by the Natural Sciences and Engineering Research Council of Canada (NSERC).

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Authors and Affiliations

  1. Machining Research Laboratory, Ontario Tech University, Oshawa, ON, Canada

    Hussien Hegab & Hossam A. Kishawy

  2. Currently at the Department of Mechanical and Aerospace Engineering, United Arab Emirates University, Al Ain, Abu Dhabi, United Arab Emirates

    Hussien Hegab

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  1. Hussien Hegab
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Correspondence to Hussien Hegab.

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Hegab, H., Kishawy, H.A. Heat transfer mechanisms of nano-cutting fluids: a comparative performance analysis model. Int J Adv Manuf Technol 124, 1429–1435 (2023). https://doi.org/10.1007/s00170-022-10579-4

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