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Review on laser-induced etching processing technology for transparent hard and brittle materials

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Abstract

The high-efficiency processing and the high geometrical precision requirements on the transparent hard-brittle optoelectrical materials are attractive to the modern industrial’s interest. Laser-induced related ablation/etching technology is proved to be effective processing for micro/nanofabrication of the transparent hard and brittle materials, due to its unique advantages of mechanical micro-machining with controllable thermal damage. There are some influencing factors like laser duration, target-to-substrate distance (work distance), target materials (absorption resolution), laser fluence, and circumstance (pressure, air, resolution) which were discussed in this review. The processing qualities in various methods were compared and described in this review. The new development of laser-induced related ablation/etching and related advanced technologies is introduced at the end of this review.

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Acknowledgements

The authors gratefully acknowledge financial support by National Natural Science Foundation of China (No. 51835004, No. 51975222, No. 51805176) and Natural Science Foundation of Fujian (Grant No. 2019J01059).

Funding

The authors gratefully acknowledge financial support by National Natural Science Foundation of China (No. 51835004, No. 51975222, No. 51805176) and Natural Science Foundation of Fujian (Grant No. 2019J01059).

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Authors and Affiliations

  1. Institute of Manufacturing Engineering, National Huaqiao University, 361021, Xiamen, People’s Republic of China

    Jialin Chen, Qiuling Wen, Feng Jiang & Jing Lu

  2. Fujian Engineering Research Center of Intelligent Manufacturing for Brittle Materials, 361021, Xiamen, People’s Republic of China

    Jialin Chen, Qiuling Wen & Feng Jiang

  3. College of Mechanical Engineering and Automation, National Huaqiao University, Xiamen, 361021, China

    Xizhao Lu

  4. Institute of Machinery Manufacturing Technology, China Academy of Engineering Physics (CAEP), Chengdu, 610200, China

    Dajiang Lei & Yongcheng Pan

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  1. Jialin Chen
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All authors have contributed to the creation of this manuscript for important intellectual content. Xizhao Lu, Feng Jiang, and Qiuling Wen provide ideas for the manuscript; Jialin Chen and Xizhao Lu collected data and wrote the manuscript. Jing Lu, Dajiang Lei, and Yongcheng Pan provided suggestions and materials for revision of the manuscript.

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Chen, J., Lu, X., Wen, Q. et al. Review on laser-induced etching processing technology for transparent hard and brittle materials. Int J Adv Manuf Technol 117, 2545–2564 (2021). https://doi.org/10.1007/s00170-021-07853-2

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