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Micro-removal mechanism of high volume fraction SiCp/Al composite in grinding based on cohesive theory

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Abstract

Grinding is the main processing method for the particle-reinforced composites, where removal mechanism is of great significance to surface usability performance. In this study, Hopkinson pressure bar tests of SiCp/Al composite were carried out, and the constitutive model of SiCp/Al composite was obtained. Based on the finite element model of Hopkinson pressure bar tests, the interfacial constitute model of SiCp/Al composite was obtained. Single abrasive grain grinding experiments were designed and conducted to obtain the grinding force. Based on the interfacial constitute model, a new integrated grinding simulation model for the high volume fraction SiCp/Al composite was established and verified by the results of the single abrasive grain experiments, then the single abrasive grain grinding force prediction model was established and verified. Several grinding mechanism models for SiCp/Al composites were proposed, and the debonding between the interface of silicon carbides and aluminum alloy was observed. Finally, the multi-abrasive grain grinding forces were measured under different grinding process parameters and the influence of the grinding process parameters on the grinding force was discussed. This research about the micro-grinding mechanism of SiCp/Al composites provides a theoretical support for the study of surface quality.

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Funding

This work was supported by the Science and Technology Program of Shanghai, China (Grant No. 20ZR1462800) and the International Exchange Program for Graduate Students, Tongji University (No.201902043).

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Each author contributed to the research presented in this manuscript, approved the contents now presented, and agreed to the compliance with ethical standards.

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Correspondence to Chuanmin Zhu.

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Gu, P., Zhu, C., Tao, Z. et al. Micro-removal mechanism of high volume fraction SiCp/Al composite in grinding based on cohesive theory. Int J Adv Manuf Technol 117, 243–265 (2021). https://doi.org/10.1007/s00170-021-07578-2

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