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Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites

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Abstract

Modeling and prediction of the damage evolution in particle reinforced composites is a complex problem. Microstructure characters such as the particle morphologies, sizes, and distribution significantly affect the damage evolution in composites. A numerical simulation has been performed to investigate the damage evolution of SiCp/AA2009 composites. Tensile deformation in SiCp/AA2009 composites was simulated using the microstructure-based model constructed from the metallograph. Matrix damage, particle cracking, and interface debonding were simulated combining the ductile damage model, the normal stress criterion, and the maximum stress ratio criterion. The simulation results show that under tensile loading, damage initiates at the interface, and then propagates along the weakest direction. The simulation microstructures agree well with experimental results in which interface debonding, particle cracking, and matrix damage co-exist. In addition, the effects of component properties on the damage evolution are examined for various situations.

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Acknowledgments

This work was supported by the National Basic Research Program of China under Grant No. 2012CB619600 and National High-tech R&D Program under Grant No. 2013AA030700. The authors would like to thank J. C. Shao and Q. Z. Wang for their helpful suggestion.

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Authors and Affiliations

  1. Institute of Metal Research, Chinese Academy of Sciences, Shenyang, 110016, China

    Y. Kan, Z. G. Liu, S. H. Zhang, M. Cheng & H. W. Song

  2. School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116024, China

    Y. Kan & L. W. Zhang

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  1. Y. Kan
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  2. Z. G. Liu
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  3. S. H. Zhang
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  4. L. W. Zhang
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Correspondence to M. Cheng.

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Kan, Y., Liu, Z.G., Zhang, S.H. et al. Microstructure-Based Numerical Simulation of the Tensile Behavior of SiCp/Al Composites. J. of Materi Eng and Perform 23, 1069–1076 (2014). https://doi.org/10.1007/s11665-013-0805-7

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  • DOI: https://doi.org/10.1007/s11665-013-0805-7

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