Abstract
The grinding residual stress plays a major role in deciding the workpiece’s surface quality, including the corrosion resistance, the fatigue property, and the reliability. Moreover, formation process of grinding residual stress accompanies with dynamic material’s removal action, which results in undulation of the mechanical parameters. The distribution of grinding residual stress is also affected by system dynamic characteristic accordingly. To this end, a sequentially coupled analytic model is established to study the influence of dynamic characteristic on the distribution of residual stress. Firstly, the grinding force with grits’ dynamic multiple interaction effects is calculated. Afterwards, the dynamic grinding thermal relaxation is figured out. According to the obtained dynamic characteristic of the machine tool, the undulation of workpiece’s residual stress distribution is subsequently studied at smaller depth of cut. It is found that the residual stress distribution mainly results from the dynamic characteristics of the machine tool, which is verified by the dynamic grinding experiments. As a result, the method can be considered an efficient reference to improve the consistency of the residual stress distribution for the workpiece in industrial grinding enterprises as well as engineering studies.
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Funding
This study was funded by the National Natural Science Foundation of China (grant number: 51775101), the Fundamental Research Funds for the Central Universities (grant number: N2024002-18), the Postdoctoral Foundation of Northeastern University (20200326), and the Fundamental Research Funds for the Central Universities (N180306003).
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Cong Sun: Presentation of the original ideas and paper original drafting
Yuan Hong: Experiments and data analysis
Shichao Xiu: Theoretical guidance
Peng Zhang: Investigation and reviewing
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Sun, C., Hong, Y., Xiu, S. et al. Investigation on the influence of dynamic characteristic on grinding residual stress. Int J Adv Manuf Technol 115, 1853–1875 (2021). https://doi.org/10.1007/s00170-021-07217-w
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DOI: https://doi.org/10.1007/s00170-021-07217-w