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Thermal simulation of the single discharge for electro-spark deposition diamond wire saw

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Abstract

Due to their excellent physical and mechanical properties, third-generation super hard semiconductor materials (such as SiC, GaN) are widely used in the field of microelectronics. From the crystal bar to electronic devices, slicing is the first machining procedure that directly affects the subsequent process. Fixed diamond wire saw has been widely used in cutting hard and brittle materials. However, the diamond grits of wire saw are bonded through the binding agent’s mechanical embedding that slicing super hard crystal is very difficult and inefficient. In order to improve the slicing efficiency, it is necessary to improve the holding strength and wear resistance of the diamond wire saw. The electro-spark deposition (ESD) process can form metallurgical bonding between metal materials at low heat input. The holding strength and wear resistance of the diamond wire saw can be effectively improved. In this paper, the mechanism of the manufacturing process of ESD diamond wire saw (ESDDWS) is introduced, and the conditions of the manufacturing process of ESDDWS are put forward. A model of the surface heat source of saw wire is established considering the wire shape. The transient thermal analysis of the single discharge of ESDDWS is carried out in ANSYS, and the effect of material compaction on material physical properties is considered. According to the simulation results, the parameter range of the manufacturing process of ESDDWS is predicted. The predictions agreed with experiment observation.

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Data availability

The data and materials supporting the results of this article are included within the article.

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Abbreviations

c :

Specific heat capacity

c s :

Specific heat capacity of gas state

c L :

Specific heat capacity of liquid state

c s :

Specific heat capacity of solid state

H melt :

Melted depth of saw wire during spark discharge

h :

Convection heat coefficient

I :

Discharge current

k :

Thermal conductivity

k e :

Effective thermal conductivity of compacted

k g :

Thermal conductivity of air

k s :

Thermal conductivity of mixtures

L L :

Latent heat of liquefaction

L g :

Latent heat of vaporization

q 0 :

Maximum heat flux

R :

Radius of plasma channel

R j :

Radius of saw wire

r :

Coordinates of cylindrical work domain

T :

Temperature

T 0 :

Environment temperature

T m :

Melting temperature

T b :

Boiling temperature

t :

Time

t on :

Pulse duration time

t off :

Pulse interval time

V ele :

Melted volume of electrode during spark discharge

V diamond :

Volume of diamond grits

z :

Coordinates of cylindrical work domain

β :

Angle between the incident direction of the heat flow and the normal direction at a point on the core wire surface

ε :

Experiment parameter

θ :

Coordinates of cylindrical work domain

ρ :

Density

ρ ele :

Density of electrode

ρ g :

Density of gas state

ρ L :

Density of liquid state

ρ p :

Density of compacted

ρ s :

Density of solid state

ρ t :

Density of mixtures

μ :

Expected value

σ :

Standard deviation

ω :

Porosity of compacted electrode

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Funding

This work is financially supported by the National Natural Science Foundation of China (No. 51575317) and the Key Research and Development Program of Shandong Province, China (No. 2019JZZY020209, No. 2019GGX104007, No. 2018GGX103039).

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Authors and Affiliations

  1. School of Mechanical Engineering, Shandong University, Jinan, 250061, China

    Chengyun Li, Peiqi Ge & Wenbo Bi

  2. Key Laboratory of High-Efficiency and Clean Mechanical Manufacture at Shandong University, Ministry of Education, Jinan, 250061, China

    Peiqi Ge

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  1. Chengyun Li
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  2. Peiqi Ge
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Contributions

Chengyun Li is the executor of article writing and experiment operation.

Peiqi Ge contributed to the conception of the work.

Wenbo Bi contributed to the experiment preparation.

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Correspondence to Peiqi Ge.

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Li, C., Ge, P. & Bi, W. Thermal simulation of the single discharge for electro-spark deposition diamond wire saw. Int J Adv Manuf Technol 114, 3597–3604 (2021). https://doi.org/10.1007/s00170-021-07132-0

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