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Microstructure affected residual stress prediction based on mechanical threshold stress in direct metal deposition of Ti-6Al-4 V

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Abstract

Although the material microstructure attributes play an important role in the mechanical properties of the additively manufactured (AM) part, their impact is largely ignored in the mechanics modeling of AM processes. A physics-based mechanical threshold stress (MTS) model is proposed to consider the material internal attributes, such as grain size and dislocation to dislocation barrier during simulation of the material flow stress and deformation. This model is based on the dislocation dynamics and thermal activation theory with a combination of three main components of athermal stress, thermal stress, and threshold stress. The MTS flow stress model is embedded into a fully coupled thermo-mechanical incremental plasticity model to predict the residual stress during AM processes from the prediction of temperature field and associated thermal stresses. The experimental measurements of residual stress are conducted on additively manufactured Ti-6Al-4 V samples for the model validation. The proposed model provides insight into the impact of microstructure on residual stress prediction in the additive manufacturing process modeling.

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Elham Mirkoohi: conceptualization, methodology, experiments, validation, modeling, investigation, writing original draft preparation, review and editing, and visualization. Mostafa Mahdavi: methodology, modeling, writing original draft preparation, and review and editing. Dongsheng Li: building AM samples, review the manuscript. Hamid Garmestani: review the manuscript, supervision. Steven Liang: review and editing, supervision, resources.

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Correspondence to Elham Mirkoohi.

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Mirkoohi, E., Mahdavi, M., Li, D. et al. Microstructure affected residual stress prediction based on mechanical threshold stress in direct metal deposition of Ti-6Al-4 V. Int J Adv Manuf Technol 112, 1705–1712 (2021). https://doi.org/10.1007/s00170-020-06526-w

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  • DOI: https://doi.org/10.1007/s00170-020-06526-w

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