Abstract
The interaction between the tool rake face and the chip is critical to chip morphology, cutting forces, surface quality, and other phenomena in machining. A large body of existing literature on nanometric machining or nano-scratching only considers the overall friction behavior by simply regarding the total force along tool movement direction as the friction force, which is not suitable for describing the intriguing friction phenomena along the tool/chip interface. In this study, the molecular dynamic (MD) simulation is used to model the nanometric machining process of single crystal copper with diamond tools. The effects of three factors, namely, tool rake angle, depth of cut, and tool travel distance, are considered. The simulation results reveal that the normal force and friction force distributions along tool/chip interface for all cases investigated are similarly shaped. It is found that the normal force consistently increases along the entire tool/chip interface when a more negative rake angle tool is used. However, the friction force increases as the rake angle becomes more negative only in the contact area close to the tool tip, and it reverses the trend in the middle of tool/chip interface. Meanwhile, the increase of depth of cut overall increases the normal force along the tool/chip interface, but the friction force does not necessarily increase. Also, the progress of tool into the work material does not change the patterns of normal force, friction force, or friction coefficient distributions to a great extent. More importantly, it is discovered that the traditional sliding model with a constant friction coefficient can be used to approximate the later section of friction distributions. However, no friction model for traditional machining is appropriate to describe the first section of friction distributions obtained from the MD simulation.
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Ji, C., Shi, J., Wang, Y. et al. A numeric investigation of friction behaviors along tool/chip interface in nanometric machining of a single crystal copper structure. Int J Adv Manuf Technol 68, 365–374 (2013). https://doi.org/10.1007/s00170-013-4734-2
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DOI: https://doi.org/10.1007/s00170-013-4734-2