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Surface finish prediction models for precision grinding of silicon

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Abstract

Conventional grinding of silicon substrates results in poor surface quality unless they are machined in ductile mode on expensive ultra-precision machine tools. However, precision grinding can be used to generate massive ductile surfaces on silicon so that the polishing time can be reduced immensely and surface quality improved. However, precision grinding has to be planned with reliability in advance and the process has to be performed with high rates of reproducibility. Therefore, this work reports the empirical models developed for surface parameters R a, R max, and R t with precision grinding parameters, depths of cut, feed rates, and spindle speeds using conventional numerical control machine tools with Box–Behnken design. Second-order models are developed for the surface parameters in relation to the grinding parameters. Analysis of variance is used to show the parameters as well as their interactions that influence the roughness models. The models are capable of navigating the design space. Also, the results show large amounts of ductile streaks at depth of cut of 20 μm, feed rate of 6.25 mm/min, and spindle speed of 70,000 rpm with a 43-nm R a. Optimization experiments by desirability function generate 37-nm R a, 400-nm R max, and 880-nm R t with massive ductile surfaces.

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References

  1. Fang FZ, Venkatesh VC (1998) Diamond cutting of silicon with nanometric finish. CIRP Ann 47(1):45–49

    Article  MathSciNet  Google Scholar 

  2. Shibata T, Fujii S, Makino E, Ideda M (1996) Ductile-regime turning mechanism of single-crystal silicon. Prec Eng 18:129–137

    Article  Google Scholar 

  3. Venkatesh VC, Fang F, Chee WK (1997) On mirror surfaces with and without polishing. CIRP Ann 46(1):505–508

    Article  Google Scholar 

  4. Komanduri R, Lucca DA, Tani Y (1997) Technological advances in fine abrasive processes. CIRP Ann 46(2):545–596

    Article  Google Scholar 

  5. Rahman M, Senthil AK, Lim HS, Fatima K (2003) Nano finish grinding of brittle materials using electrolytic in-process dressing (ELID) technique. Sadhana 28(5):957–974

    Article  Google Scholar 

  6. Zhang B, Yang F, Wang J, Zhu Z, Monahan R (2000) Stock removal rate and workpiece strength in multi-pass grinding of ceramics. J Mater Process Technol 104:178–184

    Article  Google Scholar 

  7. Blackley WS, Scattergood RO (1991) Ductile-regime machining model for diamond turning of brittle materials. Prec Eng 13(2):95–102

    Article  Google Scholar 

  8. König W, Sinhoff V (1992) Ductile grinding of ultra-precise aspherical optical lenses. SPIE, Lens and Optical Systems Design 1780:778–788

    Google Scholar 

  9. Zhong ZW (2003) Ductile or partial ductile mode machining of brittle materials. Int J Adv Manuf Technol 21:579–585

    Article  Google Scholar 

  10. Ong NS, Venkatesh VC (1998) Semi-ductile grinding and polishing of Pyrex glass. J Mater Process Technol 83:261–266

    Article  Google Scholar 

  11. Venkatesh VC, Izman S, Sharif S, Mon TT, Konneh M (2003) Ductile streaks in precision grinding of hard and brittle materials. Sadhana 28(5):915–924

    Article  Google Scholar 

  12. Venkatesh VC, Izman S (2007) Development of a novel binderless diamond grinding wheel for machining IC chips for failure analysis. J Mater Process Technol 185:31–37

    Article  Google Scholar 

  13. Izman S, Venkatesh VC (2007) Gelling of chips during vertical surface diamond grinding of BK7 glass. J Mater Process Technol 185:178–183

    Article  Google Scholar 

  14. Venkatesh VC, Izman S, Vichare PS, Mon TT, Murugan S (2005) The novel bondless wheel, spherical glass chips and a new method of aspheric generation. J Mater Process Technol 167:184–190

    Google Scholar 

  15. Liu JH, Pei ZJ, Graham RF (2007) ELID grinding of silicon wafers: a literature review. Int J Mach Tool Manuf 47:529–536

    Article  Google Scholar 

  16. Thomas TR (1999) Rough surface. Imperial College Press, London

    Google Scholar 

  17. Inasaki I (1987) Grinding of hard and brittle materials. CIRP Ann 36(2):463–471

    Article  Google Scholar 

  18. Bridgman PW (1953) Effects of very high-pressure on glass. J Appl Physics 24:405–413

    Article  Google Scholar 

  19. Komanduri R, Chandrasekaran N, Raff LM (2001) Molecular dynamics simulation of nanometric cutting of silicon. Philos Mag 81(12):1989–2019

    Google Scholar 

  20. Fang FZ, Zhang GX (2003) An experimental study of edge radius effect on cutting single crystal silicon. Int J Adv Manuf Technol 22:703–707

    Article  Google Scholar 

  21. Shaw MC (1995) Precision finishing. Ann CIRP 44(1):343–348

    Article  Google Scholar 

  22. Liu K, Li X, Liang SY, Liu XD (2004) Nanometer scale ductile mode cutting of soda-lime glass. Trans NAMRI/SME 32:39–45

    MATH  Google Scholar 

  23. Liu K, Li X, Liang XY, Liu XD (2005) Nanometer-scale, ductile-mode cutting of soda-lime glass. J Manuf Process 7(2):95–101

    Article  Google Scholar 

  24. Miyashita M (1989) Brittle/ductile machining. Fifth international seminar on precision engineering, Monterey, CA, USA

  25. Masuzawa T, Tönshoff HK (1977) Three-dimensional micromachining by machine tools. CIRP Ann 46:621–628

    Article  Google Scholar 

  26. Montgomery DC, Runger GC, Hubele NF (1998) Engineering statistics. Wiley, New York

    Google Scholar 

  27. Krajnik P, Kopac J, Sluga A (2005) Design of grinding factors based on response surface methodology. J Mater Process Technol 162–163(SPEC ISS):629–636

    Article  Google Scholar 

  28. Alao A-R, Konneh M (2009) A response surface methodology based approach to machining processes: modelling and quality of the models. Int J Exp Des Process Optim 1(2/3):240–261

    Article  Google Scholar 

  29. Derringer G, Suich R (1980) Simultaneous optimization of several response variables. J Qual Technol 12(4):214–219

    Google Scholar 

  30. Stephenson DA, Agapiou JS (1997) Metal cutting theory and practice. Marcel Dekker, New York

    Google Scholar 

  31. Rusnaldy, Ko TJ, Kim HS (2008) An experimental study on microcutting of silicon using a micromilling machine. Int J Adv Manuf Technol 39:85–91

  32. Matsuo T, Touge M, Yamada H (1997) High-precision surface grinding of ceramics with superfine grain diamond cup wheel. CIRP Ann 46(1):249–252

    Article  Google Scholar 

  33. Routara BC, Bandyopadhyay A, Sahoo P (2009) Roughness modeling and optimization in CNC end milling using response surface method: effect of workpiece material variation. Int J Adv Manuf Technol 40:1166–1180

    Article  Google Scholar 

  34. Fang N (2005) Tool-chip friction in machining with a large negative rake angle tool. Wear 258:25–29

    Google Scholar 

  35. Alao AR (2007) Precision micro-scaled partial ductile mode machining of silicon. Dissertation, International Islamic University Malaysia

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Authors and Affiliations

  1. Advanced Manufacturing and Materials Processing Technology (AMMPT) Laboratory, Department of Engineering Design & Manufacture, Faculty of Engineering Building, University of Malaya, 50603, Kuala Lumpur, Malaysia

    Abdur-Rasheed Alao

  2. Department of Manufacturing and Materials Engineering, International Islamic University Malaysia (IIUM), P.O. Box 10, 50728, Kuala Lumpur, Malaysia

    Mohamed Konneh

Authors
  1. Abdur-Rasheed Alao
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  2. Mohamed Konneh
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Correspondence to Abdur-Rasheed Alao.

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Alao, AR., Konneh, M. Surface finish prediction models for precision grinding of silicon. Int J Adv Manuf Technol 58, 949–967 (2012). https://doi.org/10.1007/s00170-011-3438-8

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  • DOI: https://doi.org/10.1007/s00170-011-3438-8

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