Skip to main content
SpringerLink
Log in

Multi-objective optimization of flat plate heat sink using Taguchi-based Grey relational analysis

  • ORIGINAL ARTICLE
  • Published:
The International Journal of Advanced Manufacturing Technology Aims and scope Submit manuscript

Abstract

This paper presents an approach for the multi-objective optimization of the flat plate heat sink using Taguchi design of experiments-based Grey relational analysis. The responses studied were electromagnetic emitted radiation, thermal resistance, average heat transfer coefficient, pressure drop, and the mass of the flat plate heat sink. The heat sink is modeled using Ansoft High Frequency Structure Simulator (HFSS) software version 12 and the value of the emitted radiation is obtained by simulation. The same heat sink is modeled using Flotherm V7.2 software for finding the thermal resistance, pressure drop, and average heat transfer coefficient. Experimental investigation was performed to find the thermal resistance and emitted radiations from the heat sink and thus the simulation model was validated with the experimental results. The simulations were continued for the combinations generated by the L27 (6 factors, three levels) Taguchi’s design of experiments using Minitab software. The factors considered for optimization are the length and width of the heat sink, fin height, base height, number of fins, and fin thickness. The multi-objective optimization problem is then converted into single-objective optimization problem using Grey relational analysis and the optimum design settings of the heat sink geometry were obtained. Also, ANOVA test was carried out for finding out the contribution and impact of each heat sink design factor towards the multiple responses of the heat sink.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Tummala R (2001) Fundamentals of microelectronic packaging. McGraw-Hill Professional

  2. Shih CJ, Liu GC (2004) Optimal design methodology of plate-fin heat sinks for electronic cooling using entropy generation strategy, components and packaging technologies. IEEE Transactions 27(3):551–559

    Google Scholar 

  3. Teertstra P, Yovanovich MM, Culham JR, Lemczyk T (1999) Analytical forced convection modeling of plate fin heat sinks. in Proc. 15th IEEE SEMI-THERM Symp

  4. Das R (1998) An investigation on radiated emissions from heat sink. IEEE Int Symp Electromagn Compat 2:784–789

    Google Scholar 

  5. Brench (1994) Heat sink radiation as a function of geometry. in proceedings. IEEE Symp, Electromoagnetic Compatibility 105–109

  6. Parry J (2000) Multiphysics modeling for electronics design. Therm Thermo Phen Elect Sys, ITTHERM 2:86–93

    Google Scholar 

  7. Mohammad G, Mohammad TB (2008) “Multilevel converter objectives: a critical evaluation and combination of available natural commuted topologies with restructured iron cores”, Proceedings of world congress on Engineering and computer science WCEC 428–433

  8. Georgerian R, Mantrose I (2003) Product safety and the heat sink—dilemma of minimizing radiated emissions and maximizing thermal cooling. IEEE Int Symp Electromagn Compat 1:134–137

    Google Scholar 

  9. Archambeault B, Pratapneni S, Zhang L, Wittwer DC, Chen J (2001) A proposed set of specific standard EMC problems to help engineers evaluate EMC modeling tools. IEEE Int Symp Electromagn Compat 2:1335–1340

    Google Scholar 

  10. Lu J, Xiao D (2007) Comparative analysis of Intel Pentium IV and IEEE/EMC TC-9/ACEM CPU heat sinks. IEEE International Symposium on Electromagnetic Compatibility 1–6

  11. Lu J, Dawson F (2006) EMC computer modeling techniques for CPU heat sink simulation. IEEE Trans Magn 42(10):3171–3173

    Article  Google Scholar 

  12. Sochoux P, Yu J, Bhobe A, Centola F (2008) Heat sink design flow for EMC. Design Con, IEC publications 1–27

  13. Visser, JA, de Kock DJ, Conradie FD. Minimisation of heatsink mass using mathematical optimization. IEEE Semiconductor Thermal Measurement and Management Symposium 252–259s

  14. Culham JR, Muzychka YS (2000) Optimization of plate fin heatsinks using entropy generation minimization. In Proc. IEEE Intersociety Conf. Thermal Phenomena

  15. Shah A, Sammakia B, Srihari H (2002) A numerical study of the thermal performance of an impingement heatsink fin shape optimization. ITHERM 298–306

  16. Khan WA, Yovanovich MM, Culham JR (2006) Optimization of microchannel heatsinks using entropy generation minimization method. IEEE International Conference on Semiconductor Thermal Measurement and Management Symposium 78–86

  17. Bar-Cohen A, Rohsenow WM (1984) Thermally optimum spacing of vertical, natural convection cooled, parallel plates. J Heat Transfer 106:116–123

    Article  Google Scholar 

  18. Bar-Cohen A (1992) State-of-the-art and trends in the thermal packaging of electronic equipment. J Electron Package 114:257–270

    Article  Google Scholar 

  19. Kraus AD, Bar-Cohen A (1995) Design and analysis of heatsinks. Wiley, New York

    Google Scholar 

  20. Chen C-T, Wu C-K, Hwang C (2008) Optimal design and control of CPU heat sink processes, components and packaging technologies. IEEE Transactions 31(1):184–195

    Google Scholar 

  21. Lin CL (2004) Use of the Taguchi method and Grey relational analysis to optimize turning operations with multiple performance characteristics. Mater Manuf Process 19(2):209–220

    Article  Google Scholar 

  22. Chiang K-T, Chang F-P, Tsai T-C (2006) Optimum design parameters of pin-fin heat sink using the grey-fuzzy logic based on the orthogonal arrays. Int Commun Heat Mass Transf 33:744–752

    Article  Google Scholar 

  23. Chou C-C, Liu N-M, Horng J-T, Chiang K-T (2009) Designing parameter optimization of a parallel-plain fin heat sink using the grey-based fuzzy algorithm with the orthogonal arrays. Int J Therm Sci 48:2271–2279

    Article  Google Scholar 

  24. Arularasan R, Velraj R (2008) Modeling and simulation of a parallel plate heat sink using computational fluid dynamics. Int J Adv Manuf Tech. doi:10.1007/s00170-008-1867-9

    Google Scholar 

  25. HFSS V12.0, Ansoft corporation http://www.ansoft.com/products/hf/hfss/

  26. Flotherm - Fluent software tutorial available at www.fluent.com

  27. Wakefield thermal compound datasheet available at http://www.wakefield.com/pdf/accessories.pdf

  28. Anabond adhesive data sheet available at http://www.anabond.com/anabondImages/anabond.pdf

  29. Douglas C. Montgomery, Design and analysis of experiments, Fifth edition. Wiley: New York. ISBN 9971-51-329-3

  30. Minitab 15 software tutorial available at: http://www.minitab.com

  31. Wang Z, Zhu L, Wu JH (1996) Grey relational analysis of correlation of errors in measurement. J Grey Syst 8(1):73–78

    MATH  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Electrical and Electronics Engineering, Anna University, Chennai, India

    S. Manivannan

  2. Department of Industrial Engineering, Anna University, Chennai, India

    S. Prasanna Devi

  3. Department of Electrical and Electronics Engineering, SSN College of Engineering, Chennai, India

    R. Arumugam

  4. Sarvajit–CAE, Chennai, India

    N. M. Sudharsan

Authors
  1. S. Manivannan
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. S. Prasanna Devi
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. R. Arumugam
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. N. M. Sudharsan
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to S. Manivannan.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Manivannan, S., Devi, S.P., Arumugam, R. et al. Multi-objective optimization of flat plate heat sink using Taguchi-based Grey relational analysis. Int J Adv Manuf Technol 52, 739–749 (2011). https://doi.org/10.1007/s00170-010-2754-8

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00170-010-2754-8

Keywords

Search

Navigation