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The online version of the original article can be found at http://dx.doi.org/10.1007/s00170-008-1639-6.
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Hui, TW., Pang, G.KH. Solder paste inspection using region-based defect detection. Int J Adv Manuf Technol 42, 735 (2009). https://doi.org/10.1007/s00170-008-1776-y
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DOI: https://doi.org/10.1007/s00170-008-1776-y