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Solder paste inspection using region-based defect detection

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A Publisher's Erratum to this article was published on 09 October 2008

Abstract

This paper introduces a new method to detect for solder paste defects on printed circuit board. This method not only recognizes volumetric defect but also shape deformity. It involves the use of the region-based classification technique. The 3D profile of solder paste block is first reconstructed using phase shift profilometry. The reconstructed 3D profile is then divided into several regions by geometric segmentation. The resulted regions include edges and top surface. Several features which represent their regions most are extracted and analyzed from the solder paste blocks. Regional classifiers are applied to process these feature spaces. The classifier outputs are then combined to form final detection result for each solder paste block. The performance of the region-based defect detection method is evaluated using 150 and 200 μm solder paste blocks.

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Authors and Affiliations

  1. Department of Electrical and Electronic Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong, China

    Tak-Wai Hui & Grantham Kwok-Hung Pang

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  1. Tak-Wai Hui
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  2. Grantham Kwok-Hung Pang
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Correspondence to Tak-Wai Hui.

Additional information

An erratum to this article can be found at http://dx.doi.org/10.1007/s00170-008-1776-y

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Hui, TW., Pang, G.KH. Solder paste inspection using region-based defect detection. Int J Adv Manuf Technol 42, 725–734 (2009). https://doi.org/10.1007/s00170-008-1639-6

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  • DOI: https://doi.org/10.1007/s00170-008-1639-6

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