Abstract
The solder tests currently used in defining solder alloy properties are not sufficient for selecting interconnect materials for improved reliability and reduced cost in automotive electronic applications. A “preventive” design approach based upon more accurate models of failure mechanisms and life prediction than are currently available will be required in order to assess solder alloys and to determine whether lead-free solders will provide improved reliability and lower-cost manufacturing options when compared to the lead-based solders currently used.
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References
Data taken from Metals Handbook, 9th ed., vol. 6 (Materials Park, OH: ASM, 1983).
T.-Y. Pan and W.L. Winterbottom, “Thermal Cycling Induced Plastic Deformation in Solder Joints,” ASME Proceedings 90-WA/EEP-13, Dallas (November 1990).
T.-Y. Pan, “Thermal Cycling Induced Plastic Deformation in Solder Joints, Part III: Strain-Energy Based Fatigue Life Model and Effects of Ramp Rate and Hold Time,” ASME Proceedings 91-WA-EEP-10, Atlanta (December 1991).
Y.-H. Pao, “Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling,” J. Electronic Packaging, 114 (June 1992), p. 135.
P.M. Hall and W.M. Sherry, “Materials, Structures and Mechanics of Solder Joints for Surface-Mount Microelectronics Technology,” Proceedings of Conference of Interconnection Technology in Electronics (W. Germany: Felbach, 1986), pp. 47–61.
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Winterbottom, W.L. Converting to lead-free solders: An automotive industry perspective. JOM 45, 20–24 (1993). https://doi.org/10.1007/BF03222375
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DOI: https://doi.org/10.1007/BF03222375