Abstract
If optoelectronics are to be widely applied in consumer products as well as specialized technologies, the cost of packaging the components must be kept down. Until recently, the specialized nature of optoelectronics applications meant that packaging was mainly an afterthought. Today, it is becoming a vital part of the overall device planning and manufacturing process. This article describes some of the technologies and costs associated with optoelectronic device packaging.
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Boudreau, R.A. Packaging for optoelectronic interconnections. JOM 46, 41–45 (1994). https://doi.org/10.1007/BF03220718
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DOI: https://doi.org/10.1007/BF03220718