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Nano- and Biotechniques for Electronic Device Packaging

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Bio and Nano Packaging Techniques for Electron Devices

Abstract

As stated in Chap. 1 packaging bridges the gap between miniaturized electronic and non-electrical function elements and components as well as to the environment in order to constitute systems with particular complex functions, that match the system to the environment given by the intended application and that secures and maintains the systems properties during entire life-time. It provides the structural scaffold and framework for the functional elements and components, it supplies electrical power, it provides the electrical connections to and between the elements and components within the system and other systems, it integrates sensor, information processing and actuator functions, it removes heat, it protects the system against mechanical, chemical, electromagnetic and other interfering factors required for reliability and it matches the system to the environment (Table 1.4). Conventional microelectronics and microsystems packaging uses classic semiconductor and microsystem technologies like thin-film technology, lithography-based patterning, bonding and wiring as well as traditional assembly processes (Table. 1.2).

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  1. Solid-State Electronics Laboratory, Technische Universität Dresden, 01062, Dresden, Germany

    Gerald Gerlach

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  1. Fak. Elektrotechnik, Inst. Festkörperelektronik, TU Dresden, Helmholtzstr. 18, Dresden, 01069, Sachsen, Germany

    Gerald Gerlach

  2. Fak. Elektrotechnik und, Informationstechnik, TU Dresden, Mommsenstr. 13, Dresden, 01069, Sachsen, Germany

    Klaus-Jürgen Wolter

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Gerlach, G. (2012). Nano- and Biotechniques for Electronic Device Packaging. In: Gerlach, G., Wolter, KJ. (eds) Bio and Nano Packaging Techniques for Electron Devices. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-28522-6_3

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