Abstract
Sur/Fin 81 — the Sixty-Eighth Annual Conference of the American Electroplaters’ Society (AES) was held in Boston, Massachusetts, from June 28th to July 2nd, 1981. Papers highlighting various aspects of gold electroplating are summarized in this review.
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References
S. Kaga, H. W. Pickering and W. R. Bitler, ‘Low Temperature Interdiffusion of Gold Electrodeposits with Their Substrates’, AES Research Project 50, Conference paper
R. Duva, ‘New Developments in High Speed Continuous Plating of Precious Metals’, Conference paper
R. J. von Gutfeld, ‘Laser Enhanced Electroplating and Etching for Maskless Pattern Generation and Circuit Repair’, Conference paper
C. Shiflett, ‘The Electrical Properties of Soft Gold’, Conference paper
C. A. Holden and R. Huik, ‘Critical Nitric Acid Vapor Test Parameters Affecting the Apparent Porosity of Thin and Selectively Plated Gold’, Conference paper
H. Griffin, A. Savolainen and R. Haschke, ‘The Use of D.C. Plasma, Echelle Grating Spectroscopy for the Analysis of Plated Gold’, Conference paper
G. I. Edson, ‘Recovery of Precious Metals for the Electroplating Industry’, Conference paper
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Blair, A. Gold plating in the electronics industry. Gold Bull 14, 167–168 (1981). https://doi.org/10.1007/BF03216562
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DOI: https://doi.org/10.1007/BF03216562