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Avoiding porosity in gold plating

A new method of studying defects and their causes

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Abstract

The essential part played by electrodeposited gold in telecommunications and computers, and in electrical and electronic equipment generally, depends upon, the production of deposits sufficiently free from pores or other defects to maintain a clean, corrosion resistant surface. The use of a scanning electron microscope to investigate porosity in gold plating has emphasised the importance of ensuring the absolute cleanliness of the surfaces to he plated.

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Authors and Affiliations

  1. The British Non-Ferrous Metals Research Association, London

    H. S. Campbell

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  1. H. S. Campbell
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Campbell, H.S. Avoiding porosity in gold plating. Gold Bull 4, 12–14 (1971). https://doi.org/10.1007/BF03215132

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  • DOI: https://doi.org/10.1007/BF03215132

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