Abstract
Self-diffusion coefficients of copper in Cu−Al solid solutions in the concentration interval 0 to 19 at. pct Al and in the temperature range 800° to 1040°C have been determined by the residual activity method using the isotope Cu64. The values of the self-diffusion coefficients in the concentration interval 0 to 14.5 at. pct Al satisfy the Arrhenius relation and their temperature dependence can be expressed by the following equations
An analysis of the results leads to the conclusion that, in the concentration interval 0 to 11.7 at. pct Al, the frequency factor and activation enthalpy concentration dependences can be described by the following equations
whereD Cu0Cu and ΔH CuCu are diffusion characteristics for self-diffusion in pure copper,X Al is the atomic percent of aluminum, andK andB are experimental constants.
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Kučera, J., Million, B. Self-diffusion of copper in Cu−Al solid solutions. Metall Trans 1, 2599–2602 (1970). https://doi.org/10.1007/BF03038390
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DOI: https://doi.org/10.1007/BF03038390