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Micro metal powder injection molding of W-Cu nanocomposite powder

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Abstract

Increasing attention is being paid to micro metal injection molding as a manufacturing technology for miniature part. W-Cu nanocomposites have been used as heat sink and packaging materials in microelectronic devices. A micro injection molding technique will provide and appropriate tool to fabricate W-Cu nanocomposite materials for microcomponents. In the present study, a fundamental investigation of micro metal injection molding using W-Cu nanocomposite powder is reported. The densification behavior of W-Cu nanocomposite was examined in order to confirm the shape stability of microcomponents.

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Authors and Affiliations

  1. Division of Materials Science and Engineering, Hanyang University, 17 Haengdam 1-dong, Seongdong-gu, 133-791, Seoul, Korea

    Soon-Wook Kim, Young-Do Kim & In-Hyung Moon

  2. Department of Materials and Metallurgical Engineering, Samcheok National University, San 245-711 Gyo-dong, Samcheok-si, 245-711, Gangwon, Korea

    Myung-Jin Suk

Authors
  1. Soon-Wook Kim
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  2. Myung-Jin Suk
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  3. Young-Do Kim
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  4. In-Hyung Moon
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Correspondence to Myung-Jin Suk.

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Kim, SW., Suk, MJ., Kim, YD. et al. Micro metal powder injection molding of W-Cu nanocomposite powder. Met. Mater. Int. 11, 205–208 (2005). https://doi.org/10.1007/BF03027443

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  • DOI: https://doi.org/10.1007/BF03027443

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