Abstract
The interfacial fracture energies of Cu/Cr/polyimide systems are deduced by subtracting work expenditure from the peel strength. Two methods were used to obtain the work expenditure: on based on the X-ray measurement of the plastic strain of peeled metal film and the other based on a theoretical analysis of the foundation model for the attached part of the metal film. These two methods yield reasonably consistent work expenditure in most cases, imparting validity to the experimental and theoretical methods used here. The interfacial fracture energies of the Cr/polyimide interface were shown w.r.t., the film thickness and rf plasma power density activating the polyimide surface. The phase angle of the interface crack between the Cu and polyimide is determined by using elasto-plastic finite element analysis and the path independence of theJ-integral. The presence of the polyimide interlayer increased mode mixity, and the phase angles were virtually independent of the metal film thickness, which is consistent with the nearly constant interfacial fracture energy with Cu film thickness.
Similar content being viewed by others
References
I. S. Park and J. Yu,Acta mater. 46, 2947 (1998).
A. K. Moidu, A. N. Sinclair and J. K. SpeltJ. Testing Eval. 23, 241 (1995).
A. K. Moidu, A. N. Sinclair and J. K. Spelt,J. Testing Eval. 26, 247 (1998).
K. S. Kim and N. Aravas,Int. J. Solids Struct. 24, 417 (1988).
A. J. Kinloch, C. C. Lau and J. G. Williams,Int. J. Fract. 66, 45 (1994).
A. Bagchi and A. G. Evans.Interface Science 3, 169 (1996).
K. S. Kim and J. Kim,J. Eng. Mater. Tech. 110, 266 (1988).
N. Aravas, K. S. Kim and M. J. Loukis,Mater. Sci. Eng. A 107, 159 (1989).
G. J. Spies,J. Aircraft Eng. 25, 64 (1953).
M. F. Kanninen,Int. J. Fract. 9, 83 (1973).
G. Fernlund and J. K. Spelt,J. Comp. Tech. Res.,16, 234 (1994).
M. D. Thouless and H. M. Jensen,J. Adhesion 38, 185 (1992).
Z. Suo and J. W. Hutchinson,Int. J. Fract. 43, 1 (1990).
Y. B. Park,Ph. D. Thesis, KAIST (1999).
Suo and J. W. Hutchinson,Mater. Sci. Eng. A 107, 135 (1989).
P. Gu,J. Appl. Mech.,60, 1052 (1993).
J. R. Rice,J. Appl. Mech. 55, 98 (1988).
J. Dundurs,J. Appl. Mech. 36, 650 (1969).
H. C. Cao and A. G. Evans,Mech. Mater. 7, 295 (1989).
K. L. Mittal,POLYIMIDES; Synthesis, Characterization Applications (1984).
N. A. Fleck, J. W. Hutchinson and Z. Suo,Int. J. Solids Struct. 27, 1683 (1991).
ABAQUS User's Manual, Ver. 5.7. HKS Inc.
N. J. Chou and C. H. Tang,J. Vac. Sci. Tech A 2, 751 (1984).
E. C. Ahn, J. Yu and I. S. Park,J. Mater. Sci. 7, 175 (1996).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Park, Y.B., Yu, J. Effects of electroplated Cu thickness and polyimide plasma treatment conditions on the interfacial fracture mechanics parameters in the Cu/Cr/polyimide system. Met. Mater. Int. 7, 123–131 (2001). https://doi.org/10.1007/BF03026950
Issue Date:
DOI: https://doi.org/10.1007/BF03026950