Abstract
A two-dimensional numerical model for an infrared reflow soldering with a convection fan is used my modifying the Eftychiou’s numerical modeling. The two-dimensional tunnel model which predicts convective conditions within the reflow oven are solved using the finite volume method with the SIMPLER algorithm. The card model solves the transient two-dimensional heat conduction equation in conjunction with a radiative heat transfer analysis. We also performed an experiment to validate the numerical modeling. The numerical result shows excellent agreement with experimental data. Based on the capability of this model, parametric simulations are performed to determine the thermal response of the solder to variations in the oven operating conditions and heat transfer conditions. This study shows that radiation and conveyor velocity are important factors in the preheat region.
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Abbreviations
- A :
-
Area
- h :
-
Convective heat transfer coefficient
- k :
-
Thermal conductivity
- T :
-
Temperature
- q″ :
-
Energy per unit area
- u, v :
-
x and y velocity components
- Γ:
-
Diffusion coefficient
- ρ:
-
Density
- ϕ:
-
General variable
References
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Siegel, R. and Howell, J. R., 1981,Thermal Radiation Heat Transfer, Washington, Hemisphere Publishing Corporation.
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Kim, M.R., Choi, Y.K., Lee, G.B. et al. Thermal investigation of an infrared reflow oven with a convection fan. KSME International Journal 12, 972–979 (1998). https://doi.org/10.1007/BF02945564
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DOI: https://doi.org/10.1007/BF02945564