Abstract
In the present work, the rounding effect in the CMP process was examined in the process conditions such as the head pressure, platen and head speed, and deposition thickness. The rounding effect according to each process condition is measured from SEM and compared with each other. From the experimental results, CMP process condition to reduce the rounding effect is determined and the rounding effect has been improved from 55nm to 29nm, which is about 47% reduction.
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Chung, MJ. Improvement of rounding effect in chemical mechanical polishing process for nano-scale manufacturing. J Mech Sci Technol 19, 2091–2095 (2005). https://doi.org/10.1007/BF02916503
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DOI: https://doi.org/10.1007/BF02916503