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Electromigration in solder joints and solder lines

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  • Lead-Free Solders
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Abstract

Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead-free solder alloys, the authors prepared solder lines in v-grooves etched on Si (001). This article discusses the results of those tests and compares the electromigration failure modes of eutectic SnPb and SnAgCu flip-chip solder joints along with the mean-timeto-failure.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, UCLA, USA

    H. Gan, W. J. Choi, G. Xu & K. N. Tu

  2. Department of Materials Science and Engineering, University of California at Los Angeles, 405 Hilgard Avenue, 90095-1595, Los Angeles, California

    H. Gan, W. J. Choi, G. Xu & K. N. Tu

Authors
  1. H. Gan
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  2. W. J. Choi
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  3. G. Xu
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  4. K. N. Tu
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Gan, H., Choi, W.J., Xu, G. et al. Electromigration in solder joints and solder lines. JOM 54, 34–37 (2002). https://doi.org/10.1007/BF02701847

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