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Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates

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Abstract

Intermetallic compounds formed during the soldering reactions between Sn-3.5Ag and Cu at temperatures ranging from 250°C to 375°C are investigated. The results indicate that scallop-shaped η-Cu6(Sn0.933 Ag0.007)5 intermetallics grow from the Sn-3.5Ag/Cu interface toward the solder matrix accompanied by Cu dissolution. Following prolonged or higher temperature reactions, ɛ-Cu3 (Sn0.996 Ag0.004) intermetallic layers appear behind the Cu6(Sn0.933 Ag0.007)5 scallops. The growth of these interfacial intermetallics is governed by a kinetic relation: ΔX=tn, where the n values for η and ɛ intermetallics are 0.75 and 0.96, respectively. The mechanisms for such nonparabolic growth of interfacial intermetallics during the liquid/solid reactions between Sn-3.5Ag solders and Cu substrates are probed.

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References

  1. J. Glazer, Int. Mater. Rev. 40, 65 (1995).

    CAS  Google Scholar 

  2. P.G. Harris and K.S. Chaggar, Soldering Surf. Mount Technol. 10, 38 (1998).

    Article  CAS  Google Scholar 

  3. P.T. Vianco, K.L. Erickson, and P.L. Hopkins, J. Electron. Mater. 23, 721 (1994).

    CAS  Google Scholar 

  4. D.R. Flander, E.G. Jacobs, and R.F. Pinizzotto, J. Electron. Mater. 26, 883 (1997).

    Google Scholar 

  5. D.R. Frear and P.T. Vianco, Metall. Mater. Trans. A 25A, 1509 (1994).

    CAS  Google Scholar 

  6. W. Yang and R.W. Messler, Jr., J. Electron. Mater. 23, 765 (1994).

    CAS  Google Scholar 

  7. J. Haimovich, AMP J. Technol. 3, 46 (1993).

    Google Scholar 

  8. H.K. Kim, H.K. Liou, and K.N. Tu, Appl. Phys. Lett. 66, 18 (1995).

    Google Scholar 

  9. H.K. Kim and K.N. Tu, Phys. Rev. B53, 16027 (1996).

    ADS  Google Scholar 

  10. S. Bader and W. Gust, Acta Mater. Metall. 43, 1 (1995).

    Google Scholar 

  11. K.S. Bae and S.J. Kim, J. Electron, Mater. 30, 1452 (2001).

    CAS  Google Scholar 

  12. P.T. Vianco, P.F. Hlava, and A.C. Kilgo, J. Electron. Mater. 23, 583 (1994).

    CAS  Google Scholar 

  13. A. Hayashi, C.R. Kao, and Y.A. Chang, Scripta Mater. 37, 393 (1997).

    Article  CAS  Google Scholar 

  14. S.W. Chen and Y.W. Yen, J. Electron. Mater. 28, 1203 (1999).

    Article  CAS  Google Scholar 

  15. M. Schaefer, R.A. Fournelle, and J. Liang, J. Electron. Mater. 27, 1167 (1998).

    Article  CAS  Google Scholar 

  16. Y.H. Tseng, M.S. Yeh, and T.H. Chuang, J. Electron. Mater. 28, 105 (1999).

    Article  CAS  Google Scholar 

  17. K. Suganuma, K.S. Kim, and S.H. Huh, Int. Symp. on Microelectronics (Washington, DC: IMAPS, 2001), pp. 529–534.

    Google Scholar 

  18. M.W. Liang, T.E. Hsieh, S.Y. Chang, and T.H. Chuang, J. Electron. Mater. 32, 952 (2003).

    Article  CAS  Google Scholar 

  19. S. Chada, R.A. Fouruelle, W. Laub, and D. Shangguan, J. Electron. Mater. 29, 1214 (2000).

    Article  CAS  Google Scholar 

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Authors and Affiliations

  1. Institute of Materials Science and Engineering, National Taiwan University, 106, Taipei, Taiwan

    T. H. Chuang, H. M. Wu, M. D. Cheng & S. Y. Chang

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  1. T. H. Chuang
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  2. H. M. Wu
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  3. M. D. Cheng
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  4. S. Y. Chang
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  5. S. F. Yen
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Chuang, T.H., Wu, H.M., Cheng, M.D. et al. Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates. J. Electron. Mater. 33, 22–27 (2004). https://doi.org/10.1007/s11664-004-0289-1

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  • DOI: https://doi.org/10.1007/s11664-004-0289-1

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