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A study of properties of plastics used for

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Abstract

Some water-ingress characteristics of 14-lead dual-in-line plastic packages have been studied at 85°C and 85% relative humidity. The materials studied were basically encapsulation-grade silicones and epoxies, some of which have had wide use by the semiconductor industry. Bulk water absorption by the silicones was much less than by epoxies and there were significant differences between two epoxies having similar basic chemistries but made by different manufacturers. The leads did not contribute to water absorption by silicone packages, but a contribution attributable to the leads was discernible in epoxy packages. An empirical correlation has been found between the measured properties of the materials and packages and available results of accelerated temperature-humidity-bias testing on live devices. A hypothesis is proposed which accounts for some of the observed differences in performance between silicone and epoxy encapsulants.

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Author notes

  1. Anh Quach

    Present address: Xerox Corporation, 1341 W. Mockingbird Lane, 75247, Dallas, Texas

Authors and Affiliations

  1. Semiconductor Products Group, Motorola Inc., 85008, Phoenix, Arizona

    Anh Quach & W. L. Hunter

Authors
  1. Anh Quach
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  2. W. L. Hunter
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Quach, A., Hunter, W.L. A study of properties of plastics used for. J. Electron. Mater. 6, 319–331 (1977). https://doi.org/10.1007/BF02660490

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  • DOI: https://doi.org/10.1007/BF02660490

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