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The relationship between moisture resistance and epoxy molding compounds in integrated circuits

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Abstract

The influence of epoxy molding compounds on metallized aluminum corrosion in a Pressure Cooker Test (P.C.T.) was investigated by a monitor chip encapsulated in a dual in-line package (D.I.P.). The monitor chip is composed of a leakage current measuring part which has opposite metallized aluminum tracks and an aluminum corrosion measuring part which has metallized fine aluminum tracks. The formulation of the epoxy molding compound was changed for the average particle size of fillers, the internal release agents, and the coupling agents. The relationships between the stress of the epoxy molding compounds and moisture resistance was also investigated by using epoxy molding compounds which had different characteristics of stress.

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Authors and Affiliations

  1. Kita-Itami Works, Mitsubishi Electric Corporation, 4-1, Mizuhara, Itami, Hyogo, Japan

    Osamu Nakagawa, Ikuo Sasaki, Hideo Hamamura & Toshinobu Banjo

Authors
  1. Osamu Nakagawa
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  2. Ikuo Sasaki
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  3. Hideo Hamamura
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  4. Toshinobu Banjo
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Nakagawa, O., Sasaki, I., Hamamura, H. et al. The relationship between moisture resistance and epoxy molding compounds in integrated circuits. J. Electron. Mater. 13, 231–250 (1984). https://doi.org/10.1007/BF02656677

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  • DOI: https://doi.org/10.1007/BF02656677

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