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Kinetic study of low-temperature transient liquid phase joining of an aluminum-sic composite

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Abstract

The transient liquid phase (TLP) joining of an aluminum 6061-SiC composite using a gallium interface has been investigated. The observed kinetics of this process suggest that diffusion occurs along interphase and subgrain boundaries at low temperatures (<723 K). An existing TLP model has been modified to account for this behavior.

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Abbreviations

C :

binary solute concentration

C β :

solute concentration in original predeposited film

t :

time coordinate

Dl, Ds:

solute diffusivity in liquid and solid

h o :

half-thickness of original predeposited solute film

ξ :

position of solid/liquid interface (x direction)

γ :

growth constant

C lα :

solute concentration at α liquidus

C αl :

solute concentration at α solidus

D app :

apparent solute diffusivity

h exp :

location of experimentally observed slope change on semilog plots

h,theo:

location of theoretically predicted slope change on semilog plots

τ :

liquid residence time

σ :

thickness of liquid film at grain boundaries

x, y :

Cartesian coordinates

h 1 h 2 :

maximum penetration distance (x direction)

h 3 :

for stages 1 through 3

t1, t2, t3:

time required to complete stages 1 through 3

X l :

volume fraction of liquid phase

I :

excess solute content

Jx, Jy:

flux of solute inx andy directions

D :

interdiffusion coefficient┐

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Authors and Affiliations

  1. Centre National D’Etudes Spatiales, Evry, France

    V. Sabathier (Director of Research)

  2. Center for Welding and Joining Research, Colorado School of Mines, 80401, Golden, CO

    G. R. Edwards (Director) & C. E. Cross (Assistant Professor)

Authors
  1. V. Sabathier
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  2. G. R. Edwards
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  3. C. E. Cross
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Sabathier, V., Edwards, G.R. & Cross, C.E. Kinetic study of low-temperature transient liquid phase joining of an aluminum-sic composite. Metall Mater Trans A 25, 2705–2714 (1994). https://doi.org/10.1007/BF02649223

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  • DOI: https://doi.org/10.1007/BF02649223

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