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Application of the thermal analysis for detection of the resinoid bond influence on quality of the compositions

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Abstract

The hardening process of bond compositions is very important technological operation from the point of view of quality and reliability of high-voltage insulation systems. The thermal analysis TMA, DTMA and DTA were used and compared for detection of the bond compositions.

Zusammenfassung

Hinsichtlich der Güte und Zuverlässigkeit von Hochspannungsisolatorsystemen ist das Aushärten von Bindemittelkombinationen ein sehr wichtiger verfahrenstechnischer Vorgang. TMA, DTMA und DTA wurden zur Detektion von Bindemittelkombinationen benutzt und miteinander verglichen.

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  1. West Bohemian University, KES/ET 306 14 Pilsen, Americka 42, Czech Republic

    L. Vaculik

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  1. L. Vaculik
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Vaculik, L. Application of the thermal analysis for detection of the resinoid bond influence on quality of the compositions. Journal of Thermal Analysis 43, 517–519 (1995). https://doi.org/10.1007/BF02546842

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  • DOI: https://doi.org/10.1007/BF02546842

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