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The comparison of the current and the enthalpy during cure of the compositions

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Abstract

The curing of composition containing epoxy bond is complicated chemical and technological process where under temperature and pressure conditions a change of its structure occurs. The structure changes are possible to know by thermal methods as DSC, DTA, etc. and also by measurement of dielectrical response under the low frequency electrical field.

Zusammenfassung

Das Aushärten von epoxybindungshaltigen Mischungen ist ein komplizierter chemischer und verfahrenstechnischer Prozeß, bei dem unter Einwirkung von Temperatur und Druck eine Strukturänderung erfolgt. Eintretende Strukturänderungen können mittels thermischer Verfahren, wie z.B mit Hilfe von DSC, DTA usw. sowie durch Dielektrizitätsmessungen in einem niederfrequenten electrischen Feld ermittelt werden.

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Reference

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Authors and Affiliations

  1. West Bohemian University, KES/ET 306 14 Pilsen, Americka 42, Czech Republic

    L. Vaculik

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  1. L. Vaculik
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Vaculik, L. The comparison of the current and the enthalpy during cure of the compositions. Journal of Thermal Analysis 43, 513–516 (1995). https://doi.org/10.1007/BF02546841

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  • DOI: https://doi.org/10.1007/BF02546841

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