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Dynamic photoelastic and dynamic finite-element analyses of dynamic-tear-test specimens

Dynamic photoelasticity and dynamic finite-element methods were used to investigate the transient response of the dynamic-tear-test specimens of Homalite-100

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Abstract

The transient response of the dynamic-tear-test specimen of a brittle material, Homalite-100, was investigated by dynamic photoelasticity and dynamic finite-element method. The dynamic stress-intensity factors obtained from dynamic photoelasticity and dynamic finite-element analyses were in reasonable agreement with each other. The dynamic finite-element analysis also showed that the dynamic-fracture-initiation toughness could be determined from the dynamicstrain response of a strain gage located near the crack tip in conjunction with a simple static analysis. Dynamic-fracture-toughness vs. crack-velocity relation was also obtained.

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Abbreviations

K ID :

plane-strain dynamic (or fast)-fracture toughness

G ID :

plane-strain dynamic-energy-release rate =\(\frac{{K_{ID}^2 (1 - v^2 )}}{E}\) whereA(c) is dynamic correction factor described in Ref. 5

K Id :

plane-strain fracture toughness under dynamic loading, i.e., dynamic-initiation fracture toughness

K IC :

plane-strain fracture toughness under static loading, i.e., standard ASTM designation

K Im :

minimum dynamic resistance of a rapidly propagating crack expressed in terms of dynamic fracture toughness

a :

crack length

c :

crack velocity

b :

DTT-specimen depth

E, v, f, p, c 1,c 2 andc p :

are defined in Table 1

References

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Mall, S., Kobayashi, A.S. & Urabe, Y. Dynamic photoelastic and dynamic finite-element analyses of dynamic-tear-test specimens. Experimental Mechanics 18, 449–456 (1978). https://doi.org/10.1007/BF02324280

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  • DOI: https://doi.org/10.1007/BF02324280

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