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Photothermoelastic analysis of stresses in multiconnected flat circular rings

Thermal stresses induced by nonsteady-state temperature profile are investigated by the authors

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Abstract

Described in this paper is an interesting application of photothermoelastic-stress-analysis techniques. The experiment required the simulation of several unusual prototype thermal conditions induced in a flat, circular, multiconnected ring. A check on the technique employed was provided by comparing experimental vs. theoretical stress profiles across a section of a doubly-connected ring.

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References

  1. Tramposch, H., and Gerard, G., ”An Exploratory Study of Three-Dimensional Photothermoelasticity”, Jnl. Appl. Mech., March 1961.

  2. Timoshenko, S., and Goodier, J., “Theory of Elasticity”, 2nd Ed., McGraw-Hill Book Co., Inc., 407 (1951).

  3. Hetényi, M., “Handbook of Experimental Stress Analysis”, John Wiley & Sons, Inc., third printing, 888–889 (June 1957).

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Authors and Affiliations

  1. Lawrence Radiation Laboratory, University of California, Livermore, Calif

    R. J. Rothstein & W. F. Kirkwood

Authors
  1. R. J. Rothstein
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  2. W. F. Kirkwood
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Rothstein, R.J., Kirkwood, W.F. Photothermoelastic analysis of stresses in multiconnected flat circular rings. Experimental Mechanics 4, 237–243 (1964). https://doi.org/10.1007/BF02322957

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  • DOI: https://doi.org/10.1007/BF02322957

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