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An electronmicroscopic study on copper precipitation by copper-resistant yeast cells

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Summary

By electronmicroscopic observation of ultrathin sections, it was revealed that sulfide of copper was precipitated richly in the cell wall of copper-resistant yeast cells cultured in a copper-containing medium. The ratio Cu:S of the precipitation seems to range from about 1.8 to 1.

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References

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Author notes

  1. Joji Ashida

    Present address: Botanical Department, Faculty of Science, Kyoto University, Japan

  2. Noboru Higashi

    Present address: Institute for Virus Research, Kyoto University, Japan

  3. Tadatoshi Kikuchi

    Present address: Botanical Department, Faculty of Science, Kyoto University, Japan

Authors and Affiliations

  1. Botanical Department, Faculty of Science, Kyoto University, Japan

    Noboru Higashi & Tadatoshi Kikuchi

  2. Institute for Virus Research, Kyoto University, Japan

    Joji Ashida & Tadatoshi Kikuchi

  3. Botanical Department, Faculty of Science, Kyoto University, Japan

    Joji Ashida & Noboru Higashi

Authors
  1. Joji Ashida
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  2. Noboru Higashi
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  3. Tadatoshi Kikuchi
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Additional information

This investigation was supported in part by a grant from Ministry of Education, Japan.

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Ashida, J., Higashi, N. & Kikuchi, T. An electronmicroscopic study on copper precipitation by copper-resistant yeast cells. Protoplasma 57, 27–32 (1963). https://doi.org/10.1007/BF01252044

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  • DOI: https://doi.org/10.1007/BF01252044

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