Combined EPMA and AES depth profiling of a multilayer Ti-Al-O-N coating

Abstract

In order to compare thin-film electron probe microanalysis (EPMA) and Auger electron spectroscopy (AES) regarding reliability in quantifying chemical compositions of Ti-Al-O-N coatings with depth, a multilayer was prepared on a silicon wafer by using reactive ionized cluster beam deposition technique. Within a total thickness of about 25 nm the composition of the multilayer varied step by step from Ti-Al-O-N at the bottom to Al-O at the top. AES and, as an innovation, EPMA crater edge profiling was applied to measure the composition with depth. For quantification special thin-film EPMA techniques based on Monte Carlo simulations were applied. The chemical binding states of Al and Ti with depth were analysed using a high resolution energy analyser (MAC 3) for the AES investigations working in the direct mode. According to the deposition procedure the concentration profiles of the components varied with depth for both AES and EPMA measurements. AES provided a better depth resolution than EPMA. To get a true calibration of the depth scale an in-situ measurement method like an optical interferometry will be required. Assuming that the relative sensitivity factors are available AES depth profiling delivers concentration profiles with good accuracy. The new EPMA application provided quantitative depth profiles concerning concentration and coverage. For EPMA crater edge profiling the coating needs to be deposited on a foreign substrate because depth distributions of elements being present in both the layer and the substrate cannot be resolved.

The combination of AES-depth profiling with EPMA crater edge profiling techniques is a powerful tool to analyse heterostructures quantitatively.