Abstract
The diffusion of Si atoms from a silicon substrate through a layer of nickel monosilicide into a Ni film is investigated in the temperature interval 470–670°K by the method of radioactive isotopes. The distribution profile of Si in NiSi and Ni is derived. The GB-diffusion parameters of Si in NiSi are determined. It is shown that when T>570°K there is an increase in the thickness of the initial NiSi layer, and a kink appears on the in D=f(1/T) curve. The associated change in the activation energy of diffusion from 0.43 (470–570°K) to 0.72 eV (570–670°K) is explained by the formation of Ni-Si and Si-O type complexes. The diffusion of silicon atoms accompanied by complex-formation processes determines the evolution of the resistivity of the Ni-NiSi-Si contact.
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Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Fizika, No. 3, pp. 78–83, March, 1985.
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Rodionov, A.I., Uskov, V.A. Low-temperature diffusion of silicon atoms in the nickel-nickel silicide-silicon system. Soviet Physics Journal 28, 242–245 (1985). https://doi.org/10.1007/BF00895915
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DOI: https://doi.org/10.1007/BF00895915