Abstract
The effect of the formation of thin films of nickel silicides on the migration of intrinsic p-type impurities in silicon was studied for the first time. It was found that bulk resistance \({{\rho }_{{v}}}\) of a single Si crystal increases by a factor of 3–4 if a NiSi2 film with thickness θ ≥ 50–100 Å forms on its surface. This is attributable to the migration of boron atoms toward the silicide film. The Si layer thickness enabling measurable boron migration was estimated at 800–1000 Å.
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Umirzakov, B.E., Tashmukhamedova, D.A., Allayarova, G.K. et al. The Effect of the Formation of Silicides on the Resistivity of Silicon. Tech. Phys. Lett. 45, 356–358 (2019). https://doi.org/10.1134/S1063785019040175
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DOI: https://doi.org/10.1134/S1063785019040175