Abstract
Palladium appears to be an important component in ohmic contact metallizations to III–V semiconductors. Very little is known about its interaction with InP. Consequently, the reaction between a thin layer of Pd (≃100 nm) and an InP substrate has been studied at annealing temperatures ranging from 250–450 °C for up to 30 sec, i.e., typical annealing conditions encountered during contact fabrication. Palladium reacts readily with InP, initially forming an amorphous ternary phase, which transforms to crystalline Pd2InP on annealing. Pd2InP has an ordered cubic structure, with a lattice parameter of 0.830 nm, and grows epitaxially on InP. Microtwins, 2–3 atomic layers thick, have been identified in the ternary phase and these form along the (110) and (\(\bar 1\)10) planes.
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Ivey, D.G., Zhang, L. & Jian, P. Interfacial reactions between palladium thin films and InP. J Mater Sci: Mater Electron 2, 21–27 (1991). https://doi.org/10.1007/BF00695000
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DOI: https://doi.org/10.1007/BF00695000