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The activation areas for grain boundary sliding

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Abstract

The activation areas for grain boundary sliding in Al, Pb, Sn, Zn, and Cu are compared with those for creep in the same materials. It is found that the activation area-stress relation for grain boundary sliding is similar to that for creep. This observation is consistent with a dislocation or ledge mechanism of grain boundary sliding.

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Author notes

  1. N. Balasubramanian & J. C. M. Li

    Present address: Materials Research Center, Allied Chemical Corporation, Morristown, NJ, USA

Authors and Affiliations

  1. Henry Krumb School of Mines, Columbia University, NY, USA

    N. Balasubramanian & J. C. M. Li

Authors
  1. N. Balasubramanian
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  2. J. C. M. Li
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Balasubramanian, N., Li, J.C.M. The activation areas for grain boundary sliding. J Mater Sci 5, 839–842 (1970). https://doi.org/10.1007/BF00574853

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  • DOI: https://doi.org/10.1007/BF00574853

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