Abstract
The thermal effects occurring during the melting of copper-tin based powder solder were studied by the method of differential calorimetry. The initial melting temperature of the solder decreased from 740 to 720°C as the lead concentration increased from 0.4 to 7.6 wt.%, and decreased to 680°C when the concentration of manganese was increased from 0.1 to 0.9 wt.%, and that of aluminum from 0.3 to 5.7 wt.%.
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References
V. A. Ponomarov, V. V. Demidenko, V. P. Zavitnevich, et al., “Composite materials with a copper and tin based solder coating and the possibility of their application in transistor assemblies,” Elektron. Tekhnika. Materialy, No. 1, (246), pp. 25–28 (1990).
N. F. Lashko and S. V. Lashko, Soldering of Metals [in Russian], Mashinostroenie, Moscow (1967), pp. 106–135.
Additional information
Scientific-Research Institute for the Materials of Electronics Technology, Kaluga. Moscow Institute for Steels and Alloys. Translated from Poroshkovaya Metallurgiya, Nos. 3–4, pp. 53–56, March–April, 1994.
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Ponomarev, V.A., Shumenko, V.N. & Lopareva, N.V. Melting characteristics of lead-tin solders obtained from powder mixtures. Powder Metall Met Ceram 33, 157–159 (1995). https://doi.org/10.1007/BF00559775
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DOI: https://doi.org/10.1007/BF00559775