Abstract
Contact angles of Au, Ag, Cu, Sn, Al and Al alloys to SiC were measured by use of sessile drops heated by a high frequency induction coil designed to be convex against the SiC plate. Three crystal configurations of α-SiC, polycrystalline plane of sintered SiC, SiC (1 1 1) plane, and SiC (1 0 0 0) plane were used as base plates. Au, Sn, Al and Al alloys showed a large contact angle of about 150 ° at each melting temperature, however those of Ag and Cu were in the range of 105–121°. Every contact angle of Al and its alloys decreased to under 90° when held at 1350 °C. SiC (1 0 0 0) plane gave a lower contact angle than the other two SiC planes for Cu, Al and Al-Si alloys.
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Takahashi, S., Kuboi, O. Study on contact angles of Au, Ag, Cu, Sn, Al and Al alloys to SiC. Journal of Materials Science 31, 1797–1802 (1996). https://doi.org/10.1007/BF00372193
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DOI: https://doi.org/10.1007/BF00372193