Abstract
The interactions between In-Sn solders and an electroless Ni-P deposit within the multilayer combinations comprised of In-Sn/electroless Ni-P/Al were investigated with the aid of heat treatments at various temperatures and durations. The main reaction product was identified with X-ray diffractometry (XRD) as In3Ni2 regardless of the In-contents of the In-Sn solders. The formation of this In3Ni2 compound occurred through the diffusion of Ni towards the In-Sn solder. The intermetallic compound layer achieved its maximum thickness within 100 h upon heat treatment at 60 ‡C; the thickness of the compound layer did not increase upon extending heat treatment. Sn tended to dissolve in the In3Ni2 compound.
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Lin, KL., Chen, CJ. The interactions between In-Sn solders and an electroless Ni-P deposit upon heat treatment. J Mater Sci: Mater Electron 7, 397–401 (1996). https://doi.org/10.1007/BF00180776
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DOI: https://doi.org/10.1007/BF00180776