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Enhanced Directional Adhesion Behavior of Mushroom-Shaped Microline Arrays

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Abstract

We report directional switchable adhesion behavior inspired by the locomotion mechanism of gecko lizard. The robust mushroom-like polydimethylsiloxane microline arrays are fabricated by using silicon based over-etching process and replica molding. The line gecko patterns attached to the glass substrate exhibit strong shear adhesion forces in parallel and perpendicular directions with respect to the line direction and high adhesion hysteresis property only in the parallel direction. We have explained the directional adhesion behavior of the line gecko pattern by comparing peeling propagation and normal adhesion phenomenon. Then, we have successfully demonstrated silicon wafer transportation with the line gecko pattern by using directional adhesion behavior of the pattern, which is high shear adhesion force and low peeling force in the parallel direction with respect to the line direction.

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Abbreviations

MEMS:

Microelectromechanical systems

SOI:

Silicon on insulator

PDMS:

Polydimethylsiloxane

SEM:

Scanning electron microscopy

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Acknowledgements

This work was supported by Incheon National University Research Grant in 2016 (20162043). This work was supported by the National Research Foundation of Korea (NRF) Grant funded by the Korea government (MSIP) (no. 2017R1C1B1005834).

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Authors and Affiliations

  1. ICT Materials Research Group, Electronics and Telecommunications Research Institute, Daejeon, 34134, Republic of Korea

    Jeong Hun Kim

  2. Department of Mechanical Engineering, Ulsan National Institute of Science and Technology, Ulsan, 44919, Republic of Korea

    Hoon Eui Jeong

  3. Department of Mechanical Engineering, Incheon National University, Incheon, 22012, Republic of Korea

    Sang Moon Kim

  4. Department of Mechanical Engineering, Chungnam National University, Daejeon, 34134, Republic of Korea

    Seong Min Kang

Authors
  1. Jeong Hun Kim
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  2. Hoon Eui Jeong
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  3. Sang Moon Kim
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  4. Seong Min Kang
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Correspondence to Sang Moon Kim or Seong Min Kang.

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Kim, J.H., Jeong, H.E., Kim, S.M. et al. Enhanced Directional Adhesion Behavior of Mushroom-Shaped Microline Arrays. Int. J. of Precis. Eng. and Manuf.-Green Tech. 7, 239–245 (2020). https://doi.org/10.1007/s40684-019-00112-6

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  • DOI: https://doi.org/10.1007/s40684-019-00112-6

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