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Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board

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Abstract

The growth of IMCs at solder/substrate interface becomes more important with the sustaining advancement of integrated circuit technology. The purpose of this study was to investigate the morphology and growth kinetics of the intermetallic compounds (IMCs) formed on the diverse copper lines (including electroless copper, electroplated copper, sputtered copper) of printed circuit board under different conditions (counting isothermal aging, thermal shock and multiple reflow). And the influence of IMCs on signal integrity after isothermal aging treatment was also discussed. The results indicate that IMCs emerged on copper lines with discrepant microstructure have evident differences in morphology and thickness while the microstructure, composition and growth thickness of the IMCs naturally get changed during variational conditions. And overgrown IMCs will further aggravate the signal transmission loss for the microstrip transmission line. These interesting evolutions in IMCs introduce advantageous assistance for further investigation of solder joint reliability in electronic packaging technology.

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Acknowledgements

The authors gratefully acknowledge the support of National Natural Science Foundation of China (Nos. 51801018 and 61974020). The work is also supported by Innovation Team Project of Zhuhai City (No. ZH0405190005PWC), and the projects of Sci & Tech planning of Guangdong Province (No. 2019B090910003) and Zhuhai City (No. ZH01084702180040HJL).

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Authors and Affiliations

  1. School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, 610054, China

    Yuanming Chen, Lingzhi Zhang, Jiaying Xu, Jianrong Fang, Xiangqing You, Guoyun Zhou, Shouxu Wang & Wei He

  2. Shenzhen Anewbest Electronic Technology Co., Ltd, Shenzhen, 518103, China

    Zhengdong Tan & Haiying Wang

  3. Zhuhai Founder Sci-Tech High-Density Electronics Co., Ltd and Zhuhai Founder Sci-Tech Multilayer Circuit Board Co., Ltd, Zhuhai , 519175, China

    Wei He, Yuyao Luo & Yiling Ye

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  1. Yuanming Chen
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Correspondence to Shouxu Wang.

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Chen, Y., Zhang, L., Xu, J. et al. Investigation on Cu–Sn intermetallic compounds growth and signal transmission loss of the diverse copper lines after soldering in printed circuit board. J Mater Sci: Mater Electron 32, 22372–22386 (2021). https://doi.org/10.1007/s10854-021-06723-7

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