Advertisement

Influence of elliptical vibration on the behavior of silicon during nanocutting

  • Houfu DaiEmail author
  • Hao Du
  • Jianbin Chen
  • Genyu Chen
ORIGINAL ARTICLE
  • 107 Downloads

Abstract

MDS (molecular dynamics simulation) was employed in this paper to study the nanometric cutting of monocrystalline silicon during the ultraprecision elliptical vibration–assisted cutting (UEVAC) process. The behavior of the workpiece during material removal by UEVAC has been studied, and the effects of different vibration frequencies, amplitude ratios, and phase differences on the deformation of the material have been carefully investigated. In these simulations, a long-range analytical bond order potential was used to model the interaction inside the silicon specimen. The results from the MDS showed that a smaller vibration frequency, higher amplitude ratio, or smaller phase difference generated less heat during cutting. Moreover, it was found that a smaller vibration frequency and a lower amplitude ratio lead to a larger material removal rate, and that a higher amplitude ratio could reduce the thickness of the subsurface damage and von Mises stress of the workpiece. However, the results showed that a smaller vibration frequency increased the overall magnitude of the resultant force. It was also found that the decrease of the amplitude ratios caused an increase in the average normal forces and the resultant forces. In addition, the use of a cutting amplitude ratio of 10/3 reduced the cutting force and tended to machine the workpiece in a more ductile mode due to there being less crack propagation. Besides, a phase difference of 120° improved the material removal rate, but a phase difference of 60° reduced the cutting force.

Keywords

Molecular dynamics Phase transformation Elliptical vibration nanocutting Subsurface damage 

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Notes

Funding information

This study received financial support from the National Natural Science Foundation of China (Grant No. 51805102), fund project for the introduction of talents in Guizhou University (No. [2017]24), Guizhou Province Education Department Youth Science and technology talent growth project (No. [2018]110), and National Natural Science Foundation cultivation project for young teachers of Guizhou University (No. [2017]5788).

References

  1. 1.
    Chavoshi SZ, Goel S, Luo X (2016) Influence of temperature on the anisotropic cutting behaviour of single crystal silicon: a molecular dynamics simulation investigation. J Manuf Process 23:201–210CrossRefGoogle Scholar
  2. 2.
    Goel S, Luo X, Agrawal A, Reuben RL (2015) Diamond machining of silicon: a review of advances in molecular dynamics simulation. Int J Mach Tool Manu 88:131–164CrossRefGoogle Scholar
  3. 3.
    Mohammadi H, Ravindra D, Kode SK, Patten JA (2015) Experimental work on micro laser-assisted diamond turning of silicon (111). J Manuf Process 19:125–128CrossRefGoogle Scholar
  4. 4.
    Brinksmeier E, Mutlugünes Y, Klocke F, Aurich JC, Shore P, Ohmori H (2010) Ultra-precision grinding. CIRP Ann Manuf Technol 59:652–671CrossRefGoogle Scholar
  5. 5.
    Sumitomo T, Huang H, Zhou L, Shimizu J (2011) Nanogrinding of multi-layered thin film amorphous Si solar panels. Int J Mach Tool Manu 51:797–805CrossRefGoogle Scholar
  6. 6.
    Sreejith PS, Ngoi BKA (2001) Material removal mechanisms in precision machining of new materials. Int J Mach Tool Manu 41:1831–1843CrossRefGoogle Scholar
  7. 7.
    Zong WJ, Sun T, Li D, Cheng K, Liang YC (2008) XPS analysis of the groove wearing marks on flank face of diamond tool in nanometric cutting of silicon wafer. Int J Mach Tool Manu 48:1678–1687CrossRefGoogle Scholar
  8. 8.
    Xiao M, Wang QM, Sato K, Karube S, Soutome T, Xu H (2006) The effect of tool geometry on regenerative instability in ultrasonic vibration cutting. Int J Mach Tool Manu 46:492–499CrossRefGoogle Scholar
  9. 9.
    Nath C, Rahman M, Andrew SSK (2007) A study on ultrasonic vibration cutting of low alloy stee. J Mater Process Technol 192:159–165CrossRefGoogle Scholar
  10. 10.
    Nath C, Rahman M (2008) Effect of machining parameters in ultrasonic vibration cutting. Int J Mach Tool Manu 48:965–974CrossRefGoogle Scholar
  11. 11.
    Ma C, Shamoto E, Moriwaki T, Zhang Y, Wang LJ (2005) Suppression of burrs in turning with ultrasonic elliptical vibration cutting. Int J Mach Tool Manu 45:1295–1300CrossRefGoogle Scholar
  12. 12.
    Xiao M, Karube S, Soutome T, Sato K (2002) Analysis of chatter suppression in vibration cutting. Int J Mach Tool Manu 42:1677–1685CrossRefGoogle Scholar
  13. 13.
    Brehl DE, Dow TA (2008) Review of vibration-assisted machining. Precis Eng 32:153–172CrossRefGoogle Scholar
  14. 14.
    Zhu Z, To S, Xiao G, Ehmann KF, Zhang G (2016) Rotary spatial vibration-assisted diamond cutting of brittle materials. Precis Eng 44:211–219CrossRefGoogle Scholar
  15. 15.
    Xiao M, Sato K, Karube S, Soutome T (2003) The effect of tool nose radius in ultrasonic vibration cutting of hard metal. Int J Mach Tool Manu 43:1375–1382CrossRefGoogle Scholar
  16. 16.
    Liu X, Wu D, Zhang J (2018) Fabrication of micro-textured surface using feed-direction ultrasonic vibration-assisted turning. Int J Adv Manuf Technol 97:3849–3857Google Scholar
  17. 17.
    Zhang C, Ehmann K, Li Y (2015) Analysis of cutting forces in the ultrasonic elliptical vibration-assisted micro-groove turning process. Int J Adv Manuf Technol 78:139–152CrossRefGoogle Scholar
  18. 18.
    Kim JD, Choi IH (1998) Characteristics of chip generation by ultrasonic vibration cutting with extremely low cutting velocity. Int J Adv Manuf Technol 14:2–6CrossRefGoogle Scholar
  19. 19.
    Kim JD, Choi IH (1997) Micro surface phenomenon of ductile cutting in the ultrasonic vibration cutting of optical plastics. J Mater Process Tech 68:89–98CrossRefGoogle Scholar
  20. 20.
    Shamoto E, Moriwaki T (1999) Ultaprecision diamond cutting of hardened steel by applying elliptical vibration cutting. CIRP Ann Manuf Technol 48:441–444CrossRefGoogle Scholar
  21. 21.
    Zhang X, Arif M, Liu K, Kumar AS, Rahman M (2013) A model to predict the critical undeformed chip thickness in vibration-assisted machining of brittle materials. Int J Mach Tool Manu 69:57–66CrossRefGoogle Scholar
  22. 22.
    Zhang XQ, Liu K, Kumar AS, Rahman M (2014) A study of the diamond tool wear suppression mechanism in vibration-assisted machining of steel. J Mater Process Technol 214:496–506CrossRefGoogle Scholar
  23. 23.
    Zhang J, Suzuki N, Wang Y, Shamoto E (2014) Fundamental investigation of ultra-precision ductile machining of tungsten carbide by applying elliptical vibration cutting with single crystal diamond. J Mater Process Technol 214:2644–2659CrossRefGoogle Scholar
  24. 24.
    Zhang J, Zhang J, Cui T, Hao Z, Zahrani ALA (2017) Sculpturing of single crystal silicon microstructures by elliptical vibration cutting. J Manuf Process 29:389–398CrossRefGoogle Scholar
  25. 25.
    Liu K, Li XP, Rahman M (2008) Characteristics of ultrasonic vibration-assisted ductile mode cutting of tungsten carbide. Int J Adv Manuf Technol 35:833–841CrossRefGoogle Scholar
  26. 26.
    Huang S, Liu X, Chen FZ, Zheng HX, Yang XL, Wu LB, Song JL, Xu WJ (2016) Diamond-cutting ferrous metals assisted by cold plasma and ultrasonic elliptical vibration. Int J Adv Manuf Technol 85:673–681CrossRefGoogle Scholar
  27. 27.
    Zhou X, Zhu Z, Zhao S, Lin J (2011) Multiscale analysis of cutting force during nano-scale vibration assisted machining. Nanosci Nanotechnol Lett 3:749–754CrossRefGoogle Scholar
  28. 28.
    Zhou X, Zhu Z, Lin J (2013) Evolution of workpiece microstructure and cutting force during ultraprecision vibration assisted machining. J Comput Theor Nanosci 10:78–85CrossRefGoogle Scholar
  29. 29.
    Zhu B, Zhao H, Zhao D, Zhang P, Yang Y, Han L, Kui H (2016) Effects of vibration frequency on vibration-assisted nano-scratch process of mono-crystalline copper via molecular dynamics simulation. AIP Adv 6:035015CrossRefGoogle Scholar
  30. 30.
    Zhu B, Zhao D, Zhao H, Guan J, Hou P, Wang S, Qian L (2017) A study on the surface quality and brittle–ductile transition during the elliptical vibration-assisted nanocutting process on monocrystalline silicon via molecular dynamic simulations. RSC Adv 7:4179–4189CrossRefGoogle Scholar
  31. 31.
    Tersoff J (1989) Modeling solid-state chemistry: interatomic potentials for multicomponent systems. Phys Rev B 39:5566–5568CrossRefGoogle Scholar
  32. 32.
    Tersoff J (1986) New empirical model for the structural properties of silicon. Phys Rev Lett 56:632–635CrossRefGoogle Scholar
  33. 33.
    Moura CS, Amaral L (2005) Molecular dynamics simulation of silicon nanostructures. Nucl Instrum Meth B 228:37–40CrossRefGoogle Scholar
  34. 34.
    Stillinger FH, Weber TA (1985) Computer simulation of local order in condensed phases of silicon. Phys Rev B 31:5262–5271CrossRefGoogle Scholar
  35. 35.
    Pastewka L, Klemenz A, Gumbsch P, Moseler M (2013) Screened empirical bond-order potentials for Si-C. Phys Rev B 87:205410CrossRefGoogle Scholar
  36. 36.
    Wang Y, Shi J, Ji C (2014) A numerical study of residual stress induced in machined silicon surfaces by molecular dynamics simulation. Appl Phys A Mater Sci Process-Mater 115:1263–1279CrossRefGoogle Scholar
  37. 37.
    Zhang L, Zhao H, Yang Y, Huang H, Ma Z, Shao M (2014) Evaluation of repeated single-point diamond turning on the deformation behavior of monocrystalline silicon via molecular dynamic simulations. Appl Phys A Mater Sci Process-Mater 116:141–150CrossRefGoogle Scholar
  38. 38.
    Zhang JJ, Sun T, Yan YD, Liang YC, Dong S (2008) Molecular dynamics simulation of subsurface deformed layers in AFM-based nanometric cutting process. Appl Surf Sci 254:4774–4779CrossRefGoogle Scholar
  39. 39.
    Zhu P, Hu Y, Ma T, Wang H (2011) Molecular dynamics study on friction due to ploughing and adhesion in nanometric scratching process. Tribol Lett 41:41–46CrossRefGoogle Scholar
  40. 40.
    Dai H, Chen G, Zhou C, Fang Q, Fei X (2017) A numerical study of ultraprecision machining of monocrystalline silicon with laser nano-structured diamond tools by atomistic simulation. Appl Surf Sci 393:405–416CrossRefGoogle Scholar
  41. 41.
    Dai H, Chen G, Fang Q, Yin J (2016) The effect of tool geometry on subsurface damage and material removal in nanometric cutting single-crystal silicon by a molecular dynamics simulation. Appl Phys A Mater 122:804CrossRefGoogle Scholar
  42. 42.
    Dai H, Chen G, Li S, Fang Q, Hu B (2017) Influence of laser nanostructured diamond tools on the cutting behavior of silicon by molecular dynamics simulation. RSC Adv 7:15596–15612CrossRefGoogle Scholar
  43. 43.
    Dai H, Chen G (2017) A molecular dynamics investigation into the mechanisms of material removal and subsurface damage of nanoscale high speed laser-assisted machining. Mol Simul 43:42–51CrossRefGoogle Scholar
  44. 44.
    Dai H, Li S, Chen G (2018) Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and laser-assisted nanoscale machining via molecular dynamics simulation. Nucl Instrum Meth B 414:61–67CrossRefGoogle Scholar
  45. 45.
    Abdulkadir LN, Abou-El-Hossein K, Jumare AI, Liman MM, Olaniyan TA, Odedeyi PB (2018) Review of molecular dynamics/experimental study of diamond-silicon behavior in nanoscale machining. Int J Adv Manuf Technol 1–55Google Scholar
  46. 46.
    Shi J, Shi Y, Liu CR (2011) Evaluation of a three-dimensional single-point turning at atomistic level by a molecular dynamic simulation. Int J Adv Manuf Technol 54:161–171CrossRefGoogle Scholar
  47. 47.
    Li J, Fang Q, Liu Y, Zhang L (2015) Scratching of copper with rough surfaces conducted by diamond tip simulated using molecular dynamics. Int J Adv Manuf Technol 77:1057–1070CrossRefGoogle Scholar
  48. 48.
    Dong G, Wang X, Gao S (2018) Molecular dynamics simulation and experiment research of cutting-tool wear mechanism for cutting aluminum alloy. Int J Adv Manuf Technol 96:1123–1137CrossRefGoogle Scholar
  49. 49.
    Tong Z, Liang Y, Yang X, Luo X (2014) Investigation on the thermal effects during nanometric cutting process while using nanoscale diamond tools. Int J Adv Manuf Technol 74:1709–1718CrossRefGoogle Scholar
  50. 50.
    Plimpton S (1995) Fast parallel algorithms for short-range molecular dynamics. J Comput Phys 117:1–19CrossRefzbMATHGoogle Scholar
  51. 51.
    Stukowski A (2009) Visualization and analysis of atomistic simulation data with OVITO–the open visualization tool. Model Simul Mater Sci Eng 18:015012CrossRefGoogle Scholar
  52. 52.
    Mylvaganam K, Zhang LC (2011) Nanotwinning in monocrystalline silicon upon nanoscratching. Scr Mater 65:214–216CrossRefGoogle Scholar
  53. 53.
    Cheong WCD, Zhang LC (2000) Molecular dynamics simulation of phase transformations in silicon monocrystals due to nano-indentation. Nanotechnology 11:173–180CrossRefGoogle Scholar
  54. 54.
    Goel S, Kovalchenko A, Stukowski A, Cross G (2016) Influence of microstructure on the cutting behaviour of silicon. Acta Mater 105:464–478CrossRefGoogle Scholar
  55. 55.
    Klemenz A, Pastewka L, Balakrishna SG, Caron A, Bennewitz R, Moseler M (2014) Atomic scale mechanisms of friction reduction and wear protection by graphene. Nano Lett 14:7145–7152CrossRefGoogle Scholar
  56. 56.
    Goel S (2014) The current understanding on the diamond machining of silicon carbide. J Phys D Appl Phys 47:243001CrossRefGoogle Scholar
  57. 57.
    Erhart P, Albe K (2005) Analytical potential for atomistic simulations of silicon, carbon, and silicon carbide. Phys Rev B 71:035211CrossRefGoogle Scholar
  58. 58.
    Kumagai T, Izumi S, Hara S, Sakai S (2007) Development of bond-order potentials that can reproduce the elastic constants and melting point of silicon for classical molecular dynamics simulation. Comput Mater Sci 39:457–464CrossRefGoogle Scholar
  59. 59.
    Chavoshi SZ, Luo X (2016) Molecular dynamics simulation study of deformation mechanisms in 3C–SiC during nanometric cutting at elevated temperatures. Mat Sci Eng A Struct 654:400–417CrossRefGoogle Scholar
  60. 60.
    Cross GLW (2011) Silicon nanoparticles: isolation leads to change. Nat Nanotechnol 6:467–468CrossRefGoogle Scholar
  61. 61.
    Wang Q, Bai Q, Chen J, Guo YB, Xie WK (2015) Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper. Appl Surf Sci 355:1153–1160CrossRefGoogle Scholar
  62. 62.
    Kim DE, Oh SI (2006) Atomistic simulation of structural phase transformations in monocrystalline silicon induced by nanoindentation. Nanotechnology 17:2259–2265CrossRefGoogle Scholar
  63. 63.
    Kovalchenko A, Gogotsi Y, Domnich V, Erdemir A (2002) Phase transformations in silicon under dry and lubricated sliding. Tribol T 45:372–380CrossRefGoogle Scholar
  64. 64.
    Gogotsi Y, Zhou G, Ku SS, Cetinkunt S (2001) Raman microspectroscopy analysis of pressure-induced metallization in scratching of silicon. Semicond Sci Technol 16:345–352CrossRefGoogle Scholar
  65. 65.
    Stukowski A, Albe K (2010) Extracting dislocations and non-dislocation crystal defects from atomistic simulation data. Model Simul Mater Sci Eng 18:085001CrossRefGoogle Scholar
  66. 66.
    Cai MB, Li XP, Rahman M (2007) Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation. J Mater Process Technol 192:607–612CrossRefGoogle Scholar
  67. 67.
    Cai MB, Li XP, Rahman M (2007) Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation. Int J Mach Tool Manu 47:75–80CrossRefGoogle Scholar

Copyright information

© Springer-Verlag London Ltd., part of Springer Nature 2019

Authors and Affiliations

  1. 1.College of Mechanical EngineeringGuizhou UniversityGuiyangChina
  2. 2.School of Mechanical Engineering and MechanicsNingbo UniversityNingboPeople’s Republic of China
  3. 3.State Key Laboratory of Advanced Design and Manufacturing for Vehicle BodyHunan UniversityChangshaPeople’s Republic of China

Personalised recommendations