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Thin film encapsulation for the organic light-emitting diodes display via atomic layer deposition

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Abstract

Organic light-emitting diodes (OLEDs) have aroused great attention due to the advantages of high luminescent efficiency, fast response time, wide viewing angle, and the compatibility with the flexible electronics. Nevertheless, the organic luminescent materials are vulnerable to environment moisture/oxygen. Thus, how to protect the OLEDs from the ambient moisture/oxygen erosion is of great importance to ensure the stability and reliability. Thin film encapsulation (TFE) via atomic layer deposition (ALD) has emerged as a potential method to meet the encapsulation requirements of OLEDs due to its unique assets. In this review, the challenges of TFE, including pinholes, crystallization, cracks, and overheated, are introduced first. The ALD-based monolayer, composite structures, and hybrid laminates were developed to improve the barrier property, flexibility, and thermal conductivity. Besides, the ALD reactors and processes for TFE are also reviewed. Finally, the challenges remained and future development in the stabilization of OLEDs via ALD are also discussed.

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Acknowledgments

This work was supported by the National Natural Science Foundation of China (51835005, 51575217, and 51702106). The authors acknowledge the Flexible Electronics Research Center of Huazhong University of Science and Technology. The authors also thank Yinghao Zhang and Yuan Lin from Huazhong University of Science and Technology and Dr. Jing Huang from Wuhan China Star Optoelectronics Technology Co., Ltd., for the instructive discussions.

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  1. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, People’s Republic of China

    Yun Li, Yingfei Xiong, Huizhi Yang, Kun Cao & Rong Chen

  2. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, People’s Republic of China

    Yun Li & Rong Chen

  3. China-EU Institute for Clean and Renewable Energy, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, People’s Republic of China

    Yingfei Xiong

  4. School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, People’s Republic of China

    Huizhi Yang

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  1. Yun Li
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Li, Y., Xiong, Y., Yang, H. et al. Thin film encapsulation for the organic light-emitting diodes display via atomic layer deposition. Journal of Materials Research 35, 681–700 (2020). https://doi.org/10.1557/jmr.2019.331

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