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Models for nanoindentation of compliant films on stiff substrates

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Abstract

Nanoindentation is an effective approach for measuring mechanical properties of nanoscale films coated on substrates, yet results obtained through the classic Oliver–Pharr model require additional consideration due to the existence of a “substrate effect” when the film is much more compliant than the substrate. In this study, different models for removing this substrate effect are compared, with focus on the Gao model, the Saha–Nix model, and the Hay model and the use of a direct finite element (FE) approach is discussed. Validity of these models is examined using load–displacement data obtained from simulated indentation of an elastic–plastic film in FEs. It is found that the performance of the analytical models varies significantly with different testing parameters, including ratio between film modulus and substrate modulus (Ef/Es), indenting ratio (hmax/film thickness), and yield strain. Choices of using a nanoindentation model to process experimental data should be made according to estimated indentation depth and modulus difference between film and substrate. An example of applying substrate removal models to experimental data is also shown.

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ACKNOWLEDGMENTS

The authors gratefully acknowledge the financial support from the National Science Foundation (NSF grant CMMI-0928050) and the Office of Naval Research (ONR grant N00014-10-1-0043/P00007 and A12161//N000014-10-1-0244). Additionally, we acknowledge the helpful discussion with Ms. Jennifer Hay at Agilent Technology and Dr. Karl Putz, Dr. Charles Wood, and Xu Cheng in the department of Mechanical Engineering at Northwestern University. We also thank the critical attention of the reviewers who provided important comments and encouraged us to greatly improve the study.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois, 60208, USA

    Yang Li & L. Catherine Brinson

  2. Department of Mechanical Engineering, Northwestern University, Evanston, Illinois, 60208, USA

    Pavan Valavala, Supinda Watcharotone & L. Catherine Brinson

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  1. Yang Li
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  2. Pavan Valavala
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  3. Supinda Watcharotone
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Correspondence to L. Catherine Brinson.

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Li, Y., Valavala, P., Watcharotone, S. et al. Models for nanoindentation of compliant films on stiff substrates. Journal of Materials Research 30, 1747–1760 (2015). https://doi.org/10.1557/jmr.2015.126

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