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The effects of deposition time on surface morphology, structural, electrical and optical properties of sputtered Ag-Cu thin films

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Abstract.

The preparation of designed nanostructured thin films combining nano grains of different compositions and physical properties represents a promising avenue for the exploration of novel collective behaviors with technological potentials. Herein, nanostructured Ag-Cu thin films with different surface morphology properties were grown by magnetron sputtering varying the deposition time (4-24 min) and fixing the other deposition conditions. X-ray diffraction studies corroborated that Cu and Ag tend to appear as separated phases with nanometric sizes due to the fact that these elements are rather immiscible. The deposited Cu tended to be partially oxidized with crystal sizes of several tens of nm, whereas the deposited Ag phase displayed a poor crystallinity with an average crystal size of around 3nm. However, at deposition time of few minutes, the formation of Ag-Cu crystals with a preferable crystallization orientation along the [111] direction was detected. The surface morphology of the obtained thin films was studied by atomic force microscopy determining the surface roughness and average particle sizes of the samples. These parameters were correlated with the plasmon resonance extinction bands of the different Ag-Cu films and their electrical properties, providing a reproducible route to obtain thin films with tuned electrical resistances and optical properties.

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References

  1. J.L. Kirschvink, A. Kirschvink-Kobayashi, B.J. Woodford, Proc. Natl. Acad. Sci. 89, 7683 (1992)

    Article  ADS  Google Scholar 

  2. A.H. Lu, E.L. Salabas, F. Schuth, Angew. Chem. Int. Ed. 46, 1222 (2007)

    Article  Google Scholar 

  3. A. Arman, T. Ghodselahi, M. Molamohammadi, S. Solaymani, H. Zahrabi, A. Ahmadpourian, Prot. Met. Phys. Chem. Surf. 51, 575 (2015)

    Article  Google Scholar 

  4. S.P. Gubin, Ros. Khim. Zh. 44, 23 (2000)

    Google Scholar 

  5. T. Ghodselahi, A. Arman, J. Mater. Sci.: Mater. Electron. 26, 4193 (2015)

    Google Scholar 

  6. M. Molamohammadi, C. Luna, A. Arman, S. Solaymani, A. Boochani, A. Ahmadpourian, A. Shafiekhani, J. Mater. Sci.: Mater. Electron. 26, 6814 (2015)

    Google Scholar 

  7. W.A. de Heer, P. Milani, A. Chatelain, Phys. Rev. Lett. 65, 488 (1990)

    Article  ADS  Google Scholar 

  8. Y. Song, Y. Ma, Y. Wang, J. Di, Y. Tu, Electrochim. Acta 55, 4909 (2010)

    Article  Google Scholar 

  9. J.-P. Lee, D. Chen, X. Li, S. Yoo, L.A. Bottomley, M.A. El-Sayed, S. Park, M. Liu, Nanoscale 5, 11620 (2013)

    Article  ADS  Google Scholar 

  10. S. Sun, C. Murray, D. Weller, L. Folks, A. Moser, Science 287, 1989 (2000)

    Article  ADS  Google Scholar 

  11. O. Pena, U. Pal, L. Rodríguez-Fernández, H.G. Silva-Pereyra, V. Rodríguez-Iglesias, J.C. Cheang-Wong, J. Arenas-Alatorre, A. Oliver, J. Phys. Chem. C 113, 2296 (2009)

    Article  Google Scholar 

  12. R. Harpeness, A. Gedanken, Langmuir 20, 3431 (2004)

    Article  Google Scholar 

  13. H. Kobayashi, M. Yamauchi, H. Kitagawa, Y. Kubota, K. Kato, M. Takata, J. Am. Chem. Soc. 132, 5576 (2010)

    Article  Google Scholar 

  14. F. Tao, M.E. Grass, Y. Zhang, D.R. Butcher, J.R. Renzas, Z. Liu, J.Y. Chung, B.S. Mun, M. Salmeron, G.A. Somorjai, Science 322, 932 (2008)

    Article  ADS  Google Scholar 

  15. Y. Sugano, Y. Shiraishi, D. Tsukamoto, S. Ichikawa, S. Tanaka, T. Hirai, Angew. Chem. 125, 5403 (2013)

    Article  Google Scholar 

  16. M. Taner, N. Sayar, I.G. Yulug, S. Suzer, J. Mater. Chem. 21, 13150 (2011)

    Article  Google Scholar 

  17. X. Gao, J. Sun, M. Hu, L. Weng, F. Zhou, W. Liu, Appl. Surf. Sci. 257, 7643 (2010)

    Article  ADS  Google Scholar 

  18. H.J. Jiang, K.S. Moon, C.P. Wong, Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials, in Proceedings of the International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005 (IEEE, 2005) pp. 173--177, DOI:10.1109/ISAPM.2005.1432072

  19. W. Bhagathsingh, A. Samson Nesaraj, Trans. Nonferrous Met. Soc. China 23, 128 (2013)

    Article  Google Scholar 

  20. J. He, V. Ji, L. Meng, Mater. Sci. Eng. A 478, 305 (2008)

    Article  Google Scholar 

  21. P. Lu, M. Chandross, T.J. Boyle, B.G. Clark, P. Vianco, APL Mater. 2, 022107 (2014)

    Article  ADS  Google Scholar 

  22. H.W. Sheng, J.H. He, E. Ma, Phys. Rev. B. 65, 184203 (2002)

    Article  ADS  Google Scholar 

  23. E. Choi, S. Lee, Y. Piao, CrystEngComm 17, 5940 (2015)

    Article  Google Scholar 

  24. K.S. Tan, K.Y. Cheong, J. Nanopart. Res. 15, 1 (2013)

    Google Scholar 

  25. T. Ghodselahi, M.A. Vesaghi, A. Gelali, H. Zahrabi, S. Solaymani, Appl. Surf. Sci. 258, 727 (2011)

    Article  ADS  Google Scholar 

  26. A. Ceylan, K. Jastrzembski, S.I. Shah, Metall. Mater. Trans. A 37, 2033 (2006)

    Article  Google Scholar 

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Ahmadpourian, A., Luna, C., Boochani, A. et al. The effects of deposition time on surface morphology, structural, electrical and optical properties of sputtered Ag-Cu thin films. Eur. Phys. J. Plus 131, 381 (2016). https://doi.org/10.1140/epjp/i2016-16381-2

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  • DOI: https://doi.org/10.1140/epjp/i2016-16381-2

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