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Complex Thermoanalytical Studies of K-800 Organosilicon Adhesive

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Abstract

This paper presents the results of a complex thermoanalytical study of K-800 organosilicon adhesive. The temperatures of curing of the adhesive composition, evaporation of the reaction products, and the onset of thermal degradation have been determined. Correlation and comparison of research results obtained by different methods has been carried out. It is shown that the results of complex thermal analytical studies can be used as the basis for assessing the quality of the adhesive joint.

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Funding

This work was supported by regular institutional funding, and no additional grants were obtained.

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Authors and Affiliations

  1. Zababakhin Russian Federal Nuclear Center—All-Russian Research Institute of Technical Physics, 456770, Snezhinsk, Russia

    Yu. M. Kozhevnikova, I. G. Tolmacheva, V. N. Borisov, O. N. Zaikovskaya, R. R. Iskhuzhin, A. F. Agafonova & I. A. Belobrova

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  1. Yu. M. Kozhevnikova
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  2. I. G. Tolmacheva
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  3. V. N. Borisov
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  4. O. N. Zaikovskaya
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  5. R. R. Iskhuzhin
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  6. A. F. Agafonova
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  7. I. A. Belobrova
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Corresponding author

Correspondence to Yu. M. Kozhevnikova.

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Translated by Sh. Galyaltdinov

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Kozhevnikova, Y.M., Tolmacheva, I.G., Borisov, V.N. et al. Complex Thermoanalytical Studies of K-800 Organosilicon Adhesive. Polym. Sci. Ser. D 16, 751–757 (2023). https://doi.org/10.1134/S1995421223030164

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